LFEC3E-5F256C

IC FPGA 160 I/O 256FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 160 56320 3100 256-BGA

Quantity 431 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O160Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3100
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits56320

Overview of LFEC3E-5F256C – EC Field Programmable Gate Array (FPGA) IC, 160 I/O, 56,320-bit RAM, 3,100 Logic Elements, 256‑BGA

The LFEC3E-5F256C is a commercial-grade field programmable gate array (FPGA) from Lattice Semiconductor Corporation supplied in a 256-ball fpBGA package (17 × 17 mm). It integrates approximately 3,100 logic elements and 56,320 bits of on-chip RAM, with 160 user I/Os, making it suitable for mid-density embedded and system integration tasks where compact packaging and moderate logic/memory resources are required.

Designed for surface-mount assembly and RoHS-compliant production, this device operates from a 1.14 V to 1.26 V core supply and across a commercial temperature range of 0 °C to 85 °C, offering a balance of power efficiency and functionality for a range of commercial electronic designs.

Key Features

  • Logic Capacity — Approximately 3,100 logic elements to implement combinational and sequential logic for control, glue logic, and mid-complexity functions.
  • Embedded Memory — Total on-chip RAM of 56,320 bits (approximately 55 Kbits) for LUT-based storage, buffering, and small data structures.
  • I/O Count — 160 user I/Os on a single device to support multiple external interfaces and mixed-signal front-ends when paired with appropriate I/O standards.
  • Package and Mounting — 256-ball fpBGA (256-FPBGA, 17 × 17 mm) in a surface-mount form factor for compact board layouts and high-density routing.
  • Power — Core voltage range of 1.14 V to 1.26 V to match low-voltage system domains and power management strategies.
  • Operating Range — Commercial operating temperature from 0 °C to 85 °C suitable for consumer and general commercial applications.
  • Regulatory — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

  • Embedded Control and Glue Logic — Implement control state machines, interface bridging, and custom peripheral logic where a compact FPGA with moderate logic density is required.
  • Communication Interfaces — Support protocol translation and I/O aggregation using the device’s 160 I/Os for medium-density communication endpoints and board-level connectivity.
  • Signal Conditioning and Small DSP Tasks — Use on-chip RAM and logic elements for buffering, formatting, and basic signal processing tasks in commercial instrumentation or consumer devices.
  • Prototyping and System Integration — Compact BGA package and surface-mount compatibility make this device suitable for integration into prototype and production PCBs where board area and I/O density matter.

Unique Advantages

  • Balanced Logic and Memory — ~3,100 logic elements paired with 56,320 bits of RAM provide a mid-density resource mix for control, interfacing, and modest data buffering without requiring a larger device.
  • High I/O Count in a Compact Package — 160 I/Os in a 17 × 17 mm 256-FPBGA enable extensive external connectivity while keeping board footprint small.
  • Low-Voltage Operation — 1.14 V to 1.26 V core supply supports modern low-voltage system domains and helps reduce overall power consumption.
  • Surface-Mount, RoHS-Compliant — Designed for standard surface-mount assembly and compliant with RoHS requirements for streamlined manufacturing and regulatory compatibility.
  • Commercial Temperature Rating — 0 °C to 85 °C operating range aligns with consumer and commercial product requirements.

Why Choose LFEC3E-5F256C?

The LFEC3E-5F256C positions itself as a compact, mid-density FPGA option for commercial embedded applications where moderate logic capacity, a practical amount of on-chip RAM, and a generous I/O complement are required. Its 256-ball fpBGA package and surface-mount compatibility make it suitable for space-constrained PCBs and modern assembly processes.

This device is well-suited to engineering teams implementing protocol bridging, control logic, and small-scale signal processing in consumer and commercial products. Its combination of logic elements, embedded memory, and I/O count offers a practical balance of integration and scalability, backed by Lattice Semiconductor’s product family support.

Request a quote or submit a procurement inquiry to receive pricing and availability for the LFEC3E-5F256C.

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