LFEC3E-5F256C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 160 56320 3100 256-BGA |
|---|---|
| Quantity | 431 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 160 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3100 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFEC3E-5F256C – EC Field Programmable Gate Array (FPGA) IC, 160 I/O, 56,320-bit RAM, 3,100 Logic Elements, 256‑BGA
The LFEC3E-5F256C is a commercial-grade field programmable gate array (FPGA) from Lattice Semiconductor Corporation supplied in a 256-ball fpBGA package (17 × 17 mm). It integrates approximately 3,100 logic elements and 56,320 bits of on-chip RAM, with 160 user I/Os, making it suitable for mid-density embedded and system integration tasks where compact packaging and moderate logic/memory resources are required.
Designed for surface-mount assembly and RoHS-compliant production, this device operates from a 1.14 V to 1.26 V core supply and across a commercial temperature range of 0 °C to 85 °C, offering a balance of power efficiency and functionality for a range of commercial electronic designs.
Key Features
- Logic Capacity — Approximately 3,100 logic elements to implement combinational and sequential logic for control, glue logic, and mid-complexity functions.
- Embedded Memory — Total on-chip RAM of 56,320 bits (approximately 55 Kbits) for LUT-based storage, buffering, and small data structures.
- I/O Count — 160 user I/Os on a single device to support multiple external interfaces and mixed-signal front-ends when paired with appropriate I/O standards.
- Package and Mounting — 256-ball fpBGA (256-FPBGA, 17 × 17 mm) in a surface-mount form factor for compact board layouts and high-density routing.
- Power — Core voltage range of 1.14 V to 1.26 V to match low-voltage system domains and power management strategies.
- Operating Range — Commercial operating temperature from 0 °C to 85 °C suitable for consumer and general commercial applications.
- Regulatory — RoHS compliant for environmental and manufacturing compatibility.
Typical Applications
- Embedded Control and Glue Logic — Implement control state machines, interface bridging, and custom peripheral logic where a compact FPGA with moderate logic density is required.
- Communication Interfaces — Support protocol translation and I/O aggregation using the device’s 160 I/Os for medium-density communication endpoints and board-level connectivity.
- Signal Conditioning and Small DSP Tasks — Use on-chip RAM and logic elements for buffering, formatting, and basic signal processing tasks in commercial instrumentation or consumer devices.
- Prototyping and System Integration — Compact BGA package and surface-mount compatibility make this device suitable for integration into prototype and production PCBs where board area and I/O density matter.
Unique Advantages
- Balanced Logic and Memory — ~3,100 logic elements paired with 56,320 bits of RAM provide a mid-density resource mix for control, interfacing, and modest data buffering without requiring a larger device.
- High I/O Count in a Compact Package — 160 I/Os in a 17 × 17 mm 256-FPBGA enable extensive external connectivity while keeping board footprint small.
- Low-Voltage Operation — 1.14 V to 1.26 V core supply supports modern low-voltage system domains and helps reduce overall power consumption.
- Surface-Mount, RoHS-Compliant — Designed for standard surface-mount assembly and compliant with RoHS requirements for streamlined manufacturing and regulatory compatibility.
- Commercial Temperature Rating — 0 °C to 85 °C operating range aligns with consumer and commercial product requirements.
Why Choose LFEC3E-5F256C?
The LFEC3E-5F256C positions itself as a compact, mid-density FPGA option for commercial embedded applications where moderate logic capacity, a practical amount of on-chip RAM, and a generous I/O complement are required. Its 256-ball fpBGA package and surface-mount compatibility make it suitable for space-constrained PCBs and modern assembly processes.
This device is well-suited to engineering teams implementing protocol bridging, control logic, and small-scale signal processing in consumer and commercial products. Its combination of logic elements, embedded memory, and I/O count offers a practical balance of integration and scalability, backed by Lattice Semiconductor’s product family support.
Request a quote or submit a procurement inquiry to receive pricing and availability for the LFEC3E-5F256C.