LFEC3E-4TN144C

The LFEC3E-4TN144C is a commercial-grade EC family FPGA offering a balance of logic capacity, on-chip memory, and flexible I/O in a compact 144-pin surface-mount package. Built on the Lattice ECP/EC family architecture, this device targets mainstream, cost-sensitive embedded designs that require reprogrammable logic, memory resources and versatile interface support.

With 3,100 logic elements and approximately 56 Kbits of total on-chip RAM, the LFEC3E-4TN144C is designed for applications that need mid-range logic density, substantial I/O and low-voltage operation.

Key Features

• Logic Capacity — 3,100 logic elements suitable for mid-density FPGA designs and logic consolidation.
• On-chip Memory — 56,320 total RAM bits (approximately 56 Kbits) for distributed and block memory needs.
• I/O Count — 97 user I/Os routed to a 144-pin package for broad external connectivity.
• Package & Mounting — 144-LQFP package; supplier device package listed as 144-TQFP (20 × 20 mm). Surface-mount mounting type.
• Core Power — Low-voltage core operation with a supply range of 1.14 V to 1.26 V (nominal 1.2 V).
• Operating Grade and Temperature — Commercial grade, operating range 0 °C to 85 °C.
• Clocking (PLLs) — Two analog PLLs for clock multiplication, division and phase shifting.
• Flexible I/O Standards — Family-level programmable I/O buffers support a wide range of interfaces including LVCMOS, LVTTL, SSTL, HSTL and high-speed differential standards such as LVDS and others.
• DDR Memory Support — Family-level dedicated DDR interface support (up to DDR400) for external memory connectivity.
• RoHS Compliant — Meets RoHS environmental requirements.
• Design Ecosystem — Supported by the ispLEVER design tool suite and pre-designed ispLeverCORE IP modules for faster development.

Typical Applications

• Mainstream Embedded Systems — Implement control logic, protocol handling and glue logic in compact embedded products where mid-range FPGA capacity is required.
• Interface Bridging — Translate, buffer and aggregate signals across multiple I/O standards using the device’s flexible sysI/O buffer capabilities.
• Memory Interface Designs — Use the device’s dedicated DDR support to implement external memory interfaces up to DDR400 for system buffering and storage tasks.
• Prototyping and Low-Cost FPGA Solutions — Suitable for cost-sensitive designs that require reprogrammable logic and vendor-supported development tools.

Unique Advantages

• Balanced Logic and Memory — 3,100 logic elements paired with ~56 Kbits of on-chip RAM provides a practical mix for many mid-range designs, reducing the need for external memory in some use cases.
• Compact, High-I/O Package — 97 I/Os in a 144-pin TQFP/LQFP footprint simplifies board-level routing while preserving ample external connectivity.
• Low-Voltage Core — 1.14 V to 1.26 V core operation lowers power use for the FPGA fabric compared with higher-voltage solutions.
• Flexible I/O and Memory Interfaces — Programmable I/O buffers and dedicated DDR support ease integration with a wide range of peripherals and memory types.
• Toolchain and IP Support — Access to ispLEVER tools and ispLeverCORE IP accelerates development and reduces time-to-prototype.
• Regulatory Compliance — RoHS compliance supports environmentally conscious product designs.

Why Choose LFEC3E-4TN144C?

The LFEC3E-4TN144C occupies a practical position for designers seeking a mid-density, low-voltage FPGA with flexible I/O and embedded memory in a 144-pin surface-mount package. Its combination of 3,100 logic elements, approximately 56 Kbits of on-chip RAM, 97 I/Os and two PLLs provides a balanced platform for mainstream embedded and interface-focused applications.

Backed by Lattice’s design tools and IP, this device is well suited for teams developing cost-sensitive, reprogrammable solutions that require reliable vendor support and a compact hardware footprint. The commercial-grade temperature range and RoHS compliance further support deployment in standard commercial products.

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