LFEC3E-4T144I

IC FPGA 97 I/O 144TQFP
Part Description

EC Field Programmable Gate Array (FPGA) IC 97 56320 3100 144-LQFP

Quantity 243 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O97Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3100
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits56320

Overview of LFEC3E-4T144I – EC Field Programmable Gate Array (FPGA) IC 97 56320 3100 144-LQFP

The LFEC3E-4T144I is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation, provided in a 144-pin LQFP surface-mount package. It integrates 3,100 logic elements, 56,320 bits of on-chip RAM, and 97 user I/O pins to support configurable digital designs.

Designed for industrial-grade applications, this device operates from 1.14 V to 1.26 V and across an extended temperature range of −40 °C to 100 °C, offering a compact, programmable platform for embedded logic, I/O expansion, and system integration tasks.

Key Features

  • Logic Fabric 3,100 logic elements and 384 logic blocks provide the programmable resources needed for custom digital functions and state machines.
  • Embedded Memory Approximately 0.056 Mbits (56,320 bits) of on-chip RAM for temporary data storage, buffering, and small LUT-based memories.
  • I/O Count 97 user I/O pins to support multiple peripheral interfaces and external device connections.
  • Power and Supply Operates from a core voltage supply range of 1.14 V to 1.26 V, allowing integration into low-voltage system domains.
  • Package and Mounting 144-LQFP surface-mount package (supplier device package listed as 144-TQFP, 20 × 20 mm footprint) for compact board-level integration.
  • Industrial Temperature Range Rated for −40 °C to 100 °C operation and designated as Industrial grade for deployment in temperature-demanding environments.
  • RoHS Compliant Environmentally compliant with RoHS requirements.

Typical Applications

  • Industrial Control Use for programmable logic, glue logic, and I/O interfacing in factory automation and process-control equipment where industrial temperature ratings are required.
  • Embedded System Prototyping Suitable for developers implementing custom digital blocks, peripheral bridging, and small-scale prototyping leveraging the device's logic and memory resources.
  • Sensor and Data Aggregation Apply the device's multiple I/O pins and on-chip memory for sensor interfacing, pre-processing, and data buffering in embedded monitoring nodes.

Unique Advantages

  • Balanced Logic and Memory: 3,100 logic elements paired with 56,320 bits of RAM enable compact implementations of control and data-path functions without external memory.
  • High I/O Count in a Compact Package: Ninety-seven user I/O pins in a 144-LQFP footprint simplify board routing while preserving connectivity to peripherals and sensors.
  • Industrial Ready: Industrial-grade classification and a −40 °C to 100 °C operating range support deployment in broader temperature environments.
  • Low-Voltage Core: A narrow core supply window (1.14 V to 1.26 V) supports integration into low-voltage system architectures.
  • Surface-Mount Packaging: 144-pin LQFP/TQFP package enables automated PCB assembly and compact system designs.
  • Regulatory Compliance: RoHS compliance facilitates use in designs requiring environmental restrictives adherence.

Why Choose LFEC3E-4T144I?

The LFEC3E-4T144I delivers a practical balance of programmable logic, embedded memory, and I/O density in a compact industrial-grade package. Its combination of 3,100 logic elements, 97 I/Os, and extended temperature rating makes it suitable for embedded control, I/O expansion, and sensor aggregation tasks where a small, configurable FPGA is required.

For design teams seeking a low-voltage, surface-mount FPGA with predictable thermal and environmental characteristics, this device provides a clear, specification-driven option that supports compact PCB integration and RoHS-compliant production.

Request a quote or contact sales to check availability, pricing, and lead times for the LFEC3E-4T144I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up