LFEC3E-4T144I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 97 56320 3100 144-LQFP |
|---|---|
| Quantity | 243 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 97 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3100 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFEC3E-4T144I – EC Field Programmable Gate Array (FPGA) IC 97 56320 3100 144-LQFP
The LFEC3E-4T144I is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation, provided in a 144-pin LQFP surface-mount package. It integrates 3,100 logic elements, 56,320 bits of on-chip RAM, and 97 user I/O pins to support configurable digital designs.
Designed for industrial-grade applications, this device operates from 1.14 V to 1.26 V and across an extended temperature range of −40 °C to 100 °C, offering a compact, programmable platform for embedded logic, I/O expansion, and system integration tasks.
Key Features
- Logic Fabric 3,100 logic elements and 384 logic blocks provide the programmable resources needed for custom digital functions and state machines.
- Embedded Memory Approximately 0.056 Mbits (56,320 bits) of on-chip RAM for temporary data storage, buffering, and small LUT-based memories.
- I/O Count 97 user I/O pins to support multiple peripheral interfaces and external device connections.
- Power and Supply Operates from a core voltage supply range of 1.14 V to 1.26 V, allowing integration into low-voltage system domains.
- Package and Mounting 144-LQFP surface-mount package (supplier device package listed as 144-TQFP, 20 × 20 mm footprint) for compact board-level integration.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation and designated as Industrial grade for deployment in temperature-demanding environments.
- RoHS Compliant Environmentally compliant with RoHS requirements.
Typical Applications
- Industrial Control Use for programmable logic, glue logic, and I/O interfacing in factory automation and process-control equipment where industrial temperature ratings are required.
- Embedded System Prototyping Suitable for developers implementing custom digital blocks, peripheral bridging, and small-scale prototyping leveraging the device's logic and memory resources.
- Sensor and Data Aggregation Apply the device's multiple I/O pins and on-chip memory for sensor interfacing, pre-processing, and data buffering in embedded monitoring nodes.
Unique Advantages
- Balanced Logic and Memory: 3,100 logic elements paired with 56,320 bits of RAM enable compact implementations of control and data-path functions without external memory.
- High I/O Count in a Compact Package: Ninety-seven user I/O pins in a 144-LQFP footprint simplify board routing while preserving connectivity to peripherals and sensors.
- Industrial Ready: Industrial-grade classification and a −40 °C to 100 °C operating range support deployment in broader temperature environments.
- Low-Voltage Core: A narrow core supply window (1.14 V to 1.26 V) supports integration into low-voltage system architectures.
- Surface-Mount Packaging: 144-pin LQFP/TQFP package enables automated PCB assembly and compact system designs.
- Regulatory Compliance: RoHS compliance facilitates use in designs requiring environmental restrictives adherence.
Why Choose LFEC3E-4T144I?
The LFEC3E-4T144I delivers a practical balance of programmable logic, embedded memory, and I/O density in a compact industrial-grade package. Its combination of 3,100 logic elements, 97 I/Os, and extended temperature rating makes it suitable for embedded control, I/O expansion, and sensor aggregation tasks where a small, configurable FPGA is required.
For design teams seeking a low-voltage, surface-mount FPGA with predictable thermal and environmental characteristics, this device provides a clear, specification-driven option that supports compact PCB integration and RoHS-compliant production.
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