LFEC3E-4TN144I

IC FPGA 97 I/O 144TQFP
Part Description

EC Field Programmable Gate Array (FPGA) IC 97 56320 3100 144-LQFP

Quantity 558 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O97Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3100
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits56320

Overview of LFEC3E-4TN144I – EC Field Programmable Gate Array (FPGA) IC 97 56320 3100 144-LQFP

The LFEC3E-4TN144I is an EC-family FPGA from Lattice Semiconductor designed to deliver mainstream FPGA functionality for cost-sensitive and industrial applications. It combines LUT-based logic fabric, flexible memory resources, and programmable I/O in a compact 144-LQFP surface-mount package.

With 3,100 logic elements, 97 user I/Os and roughly 56 Kbits of on-chip RAM, this device targets embedded control, system integration and memory-interfacing roles where moderate logic density, flexible interfaces and industrial temperature range are required.

Key Features

  • Core architecture  LUT-based FPGA fabric providing 3,100 logic elements suitable for moderate-complexity designs.
  • Logic resources  384 logic blocks (PFUs/PFFs) to structure logic and routing across the device.
  • On-chip memory  Total RAM of 56,320 bits (approximately 56 Kbits) for distributed and embedded memory needs.
  • I/O flexibility  97 I/Os with programmable sysI/O™ buffer support for a wide range of interfaces, including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
  • Dedicated memory support  Family-level support for DDR memory interfaces (up to DDR400) to simplify external memory integration.
  • Clocking  Includes up to two sysCLOCK™ analog PLLs for clock multiply, divide and phase shifting.
  • Power  Operates within a 1.14 V to 1.26 V supply range (1.2 V nominal operation).
  • Package & mounting  144-LQFP (supplier package: 144-TQFP, 20 × 20 mm) surface-mount package for compact board integration.
  • Temperature & grade  Industrial grade device rated for operation from −40 °C to 100 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial control  Embedded control and supervisory functions that require industrial temperature range and moderate logic density.
  • System glue logic  Protocol bridging, bus interfacing and custom logic between subsystems using flexible I/O options.
  • Memory interface  External memory controller or buffering applications leveraging the family’s DDR interface support.
  • Embedded connectivity  Sensor aggregation, display or peripheral interface implementations utilizing the device’s broad I/O standards support.

Unique Advantages

  • Right-sized logic density: 3,100 logic elements and 384 logic blocks provide balanced capacity for mid-range FPGA designs without excessive overhead.
  • Flexible interfaces: Programmable sysI/O buffer supports multiple signaling standards, simplifying integration with diverse peripherals and buses.
  • On-chip memory for local buffering: Approximately 56 Kbits of RAM enables localized data storage and distributed memory architectures.
  • Industrial-ready thermal performance: −40 °C to 100 °C rating supports deployment in demanding environments.
  • Compact, board-friendly package: 144-LQFP (20 × 20 mm) surface-mount package enables dense PCB layouts and straightforward assembly.
  • Design ecosystem support: Family-level datasheet and tool support enable efficient design implementation and migration within the LatticeECP/EC family.

Why Choose LFEC3E-4TN144I?

The LFEC3E-4TN144I positions itself as a practical choice for engineers who need a mid-density FPGA with flexible I/O, on-chip memory and industrial temperature capability in a compact package. It leverages the LatticeECP/EC family architecture—LUT-based logic, embedded and distributed memory resources, and programmable I/O—to address mainstream embedded and system-integration challenges.

This device is well suited to customers building industrial control systems, interface bridging solutions, and memory-interfacing designs that require reliable operation across −40 °C to 100 °C, low-voltage operation around 1.2 V, and a dense set of I/O options for varied signaling standards.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for LFEC3E-4TN144I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up