LFEC3E-4T144C

The LFEC3E-4T144C is an EC Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial embedded logic applications. It provides 3,100 logic elements, approximately 56,320 bits of on-chip RAM and up to 97 I/Os in a 144-LQFP surface-mount package.

With a core supply range of 1.14–1.26 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets general-purpose programmable logic tasks where compact package density, a defined I/O count and on-chip memory are required.

Key Features

• Logic Capacity — 3,100 logic elements to implement custom combinational and sequential logic functions.
• On‑Chip Memory — 56,320 bits of embedded RAM for buffering, small look-up tables or state storage.
• I/O Count — 97 I/Os to support a broad set of peripheral interfaces and board-level connections.
• Power Supply — Core voltage range of 1.14 V to 1.26 V for compatibility with low-voltage system designs.
• Package & Mounting — 144-LQFP (supplier package noted as 144-TQFP, 20 × 20) in a surface-mount configuration for board-level integration.
• Operating Range & Grade — Commercial grade with an operating temperature range from 0 °C to 85 °C.
• RoHS Compliance — Device is RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Commercial Embedded Systems — Implement control logic, glue logic and custom peripherals using the device’s 3,100 logic elements and 97 I/Os.
• Interface Bridging — Provide protocol adaptation or I/O expansion where up to 97 configurable I/Os and embedded RAM support buffering and data handling.
• Consumer Electronics — Integrate application-specific logic in compact, surface-mount 144-LQFP packages for space-constrained designs within commercial temperature ranges.

Unique Advantages

• Right‑sized Logic Density: 3,100 logic elements offer a balance between capability and footprint for mid-range programmable tasks without excessive device complexity.
• Built‑in Memory: Approximately 56,320 bits of on-chip RAM reduce the need for external memory for small buffers and LUT-based functions, simplifying board design.
• Flexible I/O Count: Ninety-seven I/Os enable multiple peripheral connections and interface implementations from a single device.
• Compact Surface‑Mount Package: The 144-LQFP package (20 × 20 supplier package reference) supports high-density PCB layouts and standard assembly processes.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C and commercial grade, making it appropriate for mainstream electronics and embedded products.
• Regulatory Compliance: RoHS compliance helps meet environmental requirements in product supply chains.

Why Choose LFEC3E-4T144C?

The LFEC3E-4T144C positions itself as a practical, commercially graded FPGA option for designers needing a moderate number of logic elements, a defined amount of on-chip RAM and a substantial I/O count in a compact 144-LQFP package. Its low-voltage core range and surface-mount package support integration into space-constrained, low-voltage system designs.

This device is well suited to engineers and procurement teams working on commercial embedded systems, interface logic and consumer electronics who require a predictable, verifiable set of specifications and RoHS compliance for production designs.

If you would like pricing, availability or to request a quote for LFEC3E-4T144C, please submit a quote request or contact sales for further assistance.