LFEC3E-4QN208C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 145 56320 3100 208-BFQFP |
|---|---|
| Quantity | 20 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 145 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3100 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFEC3E-4QN208C – EC Field Programmable Gate Array (FPGA) IC, 145 I/Os, ~56.3Kbits RAM, 3.1K Logic Elements, 208-BFQFP
The LFEC3E-4QN208C is a Lattice EC family FPGA optimized for cost-sensitive, mainstream applications. It integrates approximately 3,100 logic elements with roughly 56,320 bits of on-chip RAM and 145 user I/Os in a 208-pin BFQFP/PQFP (28 × 28 mm) surface-mount package. The device is designed for embedded control, interface bridging and low-cost system integration where compact packaging and a low-voltage core are required.
Key Features
- Logic Capacity Approximately 3,100 logic elements (3.1K LUTs) providing a compact fabric for glue logic, control and moderate-density integration.
- On-chip Memory Embedded memory totaling 56,320 bits composed of block and distributed RAM resources for buffers, FIFOs and small data stores; family data indicates approximately 55 Kbits of block EBR plus 12 Kbits of distributed RAM.
- I/O Up to 145 user I/Os in the 208-pin PQFP/BFQFP package, supporting a wide range of standard interfaces for system-level connectivity.
- Core Supply Low-voltage core operation with a supply range of 1.14 V to 1.26 V suitable for low-power FPGA designs.
- Clocking Includes device-level PLL resources (2 PLLs for the LFEC3 series) for clock management and frequency synthesis.
- Memory Interface Support Family-level support for dedicated DDR memory interfaces, including implementations up to DDR400 (200 MHz), enabling external memory connectivity where required.
- Flexible I/O Standards Family documentation lists programmable I/O support for common signaling standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and others) to accommodate diverse interface needs.
- Package & Mounting 208-BFQFP / 208-PQFP (28 × 28 mm) surface-mount package for through-hole-free PCB assembly and standard SMT workflows.
- Operating Range & Compliance Commercial temperature rating from 0 °C to 85 °C and RoHS compliant.
Typical Applications
- Embedded Control Microcontroller offload, peripheral aggregation and user-interface control where a modest logic count and embedded memory reduce external components.
- Interface Bridging Protocol conversion and I/O adaptation using the device’s flexible I/O support and abundant user I/Os for signal conditioning and gating.
- Memory Buffering and Interfaces Buffer and interface logic for systems that require dedicated DDR connectivity or local FIFOs leveraging on-chip RAM and PLLs for timing.
- Prototyping & Development Low-cost platform for validating mid-density FPGA designs and migrating to other densities within the same family.
Unique Advantages
- Compact, Mid-range Integration: Combines ~3.1K logic elements and ~56.3Kbits of on-chip RAM to implement moderate-complexity functions without large external logic arrays.
- High I/O Count in PQFP Package: 145 I/Os in a 208-pin (28 × 28 mm) PQFP/BFQFP package enable rich connectivity while maintaining a standard SMT footprint.
- Low-voltage Core: 1.14–1.26 V supply minimizes core power for designs targeting lower power budgets.
- Family-level Design Migration: Part of the LatticeECP/EC family with density migration guidance, simplifying scaling to higher or lower density devices within the family.
- Flexible Interface Support: Family documentation details support for multiple I/O standards, easing integration with heterogeneous peripherals and memory devices.
- Regulatory and Assembly Ready: RoHS-compliant, surface-mount package suitable for standard PCB assembly processes.
Why Choose LFEC3E-4QN208C?
The LFEC3E-4QN208C positions itself as a cost-effective, mid-density FPGA for applications that require a balanced mix of logic resources, embedded RAM and a high count of I/Os in a compact surface-mount package. Its low-voltage core, family-level support for DDR interfaces and programmable I/O options make it a practical choice for embedded systems, interface modules and prototype development where BOM reduction and flexible connectivity matter.
Designed for commercial-temperature environments and RoHS compliance, the device is suitable for consumer and business electronics projects that demand a reliable, compact FPGA solution with straightforward scalability within the Lattice EC family.
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