LFEC3E-4QN208C

IC FPGA 145 I/O 208QFP
Part Description

EC Field Programmable Gate Array (FPGA) IC 145 56320 3100 208-BFQFP

Quantity 20 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O145Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3100
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits56320

Overview of LFEC3E-4QN208C – EC Field Programmable Gate Array (FPGA) IC, 145 I/Os, ~56.3Kbits RAM, 3.1K Logic Elements, 208-BFQFP

The LFEC3E-4QN208C is a Lattice EC family FPGA optimized for cost-sensitive, mainstream applications. It integrates approximately 3,100 logic elements with roughly 56,320 bits of on-chip RAM and 145 user I/Os in a 208-pin BFQFP/PQFP (28 × 28 mm) surface-mount package. The device is designed for embedded control, interface bridging and low-cost system integration where compact packaging and a low-voltage core are required.

Key Features

  • Logic Capacity  Approximately 3,100 logic elements (3.1K LUTs) providing a compact fabric for glue logic, control and moderate-density integration.
  • On-chip Memory  Embedded memory totaling 56,320 bits composed of block and distributed RAM resources for buffers, FIFOs and small data stores; family data indicates approximately 55 Kbits of block EBR plus 12 Kbits of distributed RAM.
  • I/O  Up to 145 user I/Os in the 208-pin PQFP/BFQFP package, supporting a wide range of standard interfaces for system-level connectivity.
  • Core Supply  Low-voltage core operation with a supply range of 1.14 V to 1.26 V suitable for low-power FPGA designs.
  • Clocking  Includes device-level PLL resources (2 PLLs for the LFEC3 series) for clock management and frequency synthesis.
  • Memory Interface Support  Family-level support for dedicated DDR memory interfaces, including implementations up to DDR400 (200 MHz), enabling external memory connectivity where required.
  • Flexible I/O Standards  Family documentation lists programmable I/O support for common signaling standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and others) to accommodate diverse interface needs.
  • Package & Mounting  208-BFQFP / 208-PQFP (28 × 28 mm) surface-mount package for through-hole-free PCB assembly and standard SMT workflows.
  • Operating Range & Compliance  Commercial temperature rating from 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Embedded Control  Microcontroller offload, peripheral aggregation and user-interface control where a modest logic count and embedded memory reduce external components.
  • Interface Bridging  Protocol conversion and I/O adaptation using the device’s flexible I/O support and abundant user I/Os for signal conditioning and gating.
  • Memory Buffering and Interfaces  Buffer and interface logic for systems that require dedicated DDR connectivity or local FIFOs leveraging on-chip RAM and PLLs for timing.
  • Prototyping & Development  Low-cost platform for validating mid-density FPGA designs and migrating to other densities within the same family.

Unique Advantages

  • Compact, Mid-range Integration: Combines ~3.1K logic elements and ~56.3Kbits of on-chip RAM to implement moderate-complexity functions without large external logic arrays.
  • High I/O Count in PQFP Package: 145 I/Os in a 208-pin (28 × 28 mm) PQFP/BFQFP package enable rich connectivity while maintaining a standard SMT footprint.
  • Low-voltage Core: 1.14–1.26 V supply minimizes core power for designs targeting lower power budgets.
  • Family-level Design Migration: Part of the LatticeECP/EC family with density migration guidance, simplifying scaling to higher or lower density devices within the family.
  • Flexible Interface Support: Family documentation details support for multiple I/O standards, easing integration with heterogeneous peripherals and memory devices.
  • Regulatory and Assembly Ready: RoHS-compliant, surface-mount package suitable for standard PCB assembly processes.

Why Choose LFEC3E-4QN208C?

The LFEC3E-4QN208C positions itself as a cost-effective, mid-density FPGA for applications that require a balanced mix of logic resources, embedded RAM and a high count of I/Os in a compact surface-mount package. Its low-voltage core, family-level support for DDR interfaces and programmable I/O options make it a practical choice for embedded systems, interface modules and prototype development where BOM reduction and flexible connectivity matter.

Designed for commercial-temperature environments and RoHS compliance, the device is suitable for consumer and business electronics projects that demand a reliable, compact FPGA solution with straightforward scalability within the Lattice EC family.

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