LFEC3E-4Q208I

The LFEC3E-4Q208I is an EC Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, packaged in a 208-BFQFP (208-PQFP 28×28) surface-mount package. It provides a balanced combination of programmable logic, on-chip memory, and I/O density targeted at industrial and embedded applications.

With 3,100 logic elements, 56,320 bits of on-chip RAM and 145 general-purpose I/O, this device supports compact, I/O‑intensive designs that require industrial temperature operation and low-voltage supply compatibility (1.14 V to 1.26 V).

Key Features

• Core / Logic 3,100 logic elements provide the programmable fabric for implementing custom logic, glue-logic, and control functions.
• Embedded Memory 56,320 bits of total on-chip RAM to support buffering, small lookup tables, and state storage within designs.
• I/O Density 145 available I/O pins enable flexible interfacing to sensors, peripherals, and external devices in I/O‑heavy applications.
• Power Supply Operates from a low-voltage supply range of 1.14 V to 1.26 V, suitable for modern low-voltage system domains.
• Package & Mounting Surface-mount 208-BFQFP (supplier device package: 208-PQFP 28×28) for compact PCB integration and high pin count routing.
• Temperature & Grade Industrial grade operation across −40 °C to 100 °C for reliability in demanding environments.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Embedded Control Use the LFEC3E-4Q208I for control and sequencing tasks in industrial systems where the industrial temperature rating and I/O count are beneficial.
• Sensor and Data Aggregation High I/O and on-chip RAM enable local aggregation, preprocessing, and buffering of sensor data before transfer to host systems.
• Board-Level Glue Logic Implement protocol translation, GPIO expansion, and custom interconnect logic to simplify PCB design and reduce discrete components.
• Prototyping and Small FPGA Designs Compact package and moderate logic capacity make this device suitable for prototype platforms and space-constrained designs requiring reprogrammability.

Unique Advantages

• Balanced Logic Capacity: 3,100 logic elements provide headroom for custom control, glue logic, and moderate FPGA functions without excessive device overhead.
• Significant On‑Chip Memory: 56,320 bits of embedded RAM allow local buffering and small data structures without external memory.
• High I/O Count: 145 I/O pins support dense peripheral and sensor connectivity, reducing the need for external I/O expanders.
• Industrial Temperature Range: Rated for −40 °C to 100 °C, enabling deployment in temperature‑stressed industrial environments.
• Low-Voltage Operation: Narrow supply range (1.14 V to 1.26 V) aligns with modern low-voltage system power rails for simplified power design.
• RoHS Compliant Packaging: Surface-mount 208-BFQFP packaging meets lead-free manufacturing requirements for many production environments.

Why Choose LFEC3E-4Q208I?

The LFEC3E-4Q208I positions itself as a compact, industrial-grade FPGA option that combines a practical logic element count with meaningful embedded RAM and a high I/O count. Its surface-mount 208-BFQFP package and low-voltage operation make it suitable for board-level integration where space, power, and I/O density matter.

This device is well suited for engineers and teams designing industrial embedded systems, sensor aggregation nodes, or board-level glue logic solutions that require reprogrammability and reliable operation across a wide temperature range. Its specifications help lower component count and simplify system architecture while maintaining RoHS compliance.

Request a quote or submit an inquiry today to evaluate LFEC3E-4Q208I for your next embedded or industrial FPGA design.