LFEC3E-4F256I

The LFEC3E-4F256I is a Lattice Semiconductor FPGA device from the LatticeECP2/M family optimized for embedded and industrial designs. It provides a compact, surface-mount 256-FPBGA (17×17 mm) package with 3,100 logic elements and 160 user I/Os to implement custom logic, I/O bridging, and control functions.

With approximately 56,320 bits of on-chip RAM, a low-voltage core supply range (1.14 V to 1.26 V) and an industrial operating range (−40 °C to 100 °C), this device targets applications that need reliable, compact programmable logic and flexible I/O in demanding environments.

Key Features

• Core (Logic Elements)  3,100 logic elements for implementing combinational and sequential logic, state machines, and custom datapaths.
• On-chip Memory  56,320 total RAM bits (approximately 0.056 Mbits) for distributed RAM and small embedded storage needs.
• I/O Capacity & Standards  160 user I/Os provided in the 256-ball package for flexible interfacing with peripherals, sensors, and external logic.
• Power  Core supply range of 1.14 V to 1.26 V to match low-voltage system rails and enable integration with modern power domains.
• Package & Mounting  256-FPBGA (17×17 mm) surface-mount package that balances pin count and board-area efficiency for compact designs.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in harsh and industrial environments.
• Compliance  RoHS compliant to support environmentally conscious manufacturing and regulatory needs.
• Family Architecture  Based on the LatticeECP2/M family architecture as documented by the manufacturer, which includes capabilities such as DSP blocks, flexible memory resources, and programmable clocking primitives (family-level features).

Typical Applications

• Industrial Control  Implement custom control logic, I/O translation, and sequencing for factory automation and process control systems using the device’s logic and I/O resources.
• Embedded Systems  Create compact, board-level programmable logic for embedded products that require moderate logic density and on-chip RAM.
• Communications & Interface Bridging  Implement protocol translation, parallel/serial interface glue logic, and custom I/O handling leveraging the 160 available I/Os.
• Prototyping & Custom IP  Rapidly iterate and validate custom digital functions and IP in a small-footprint, industrial-grade FPGA package.

Unique Advantages

• Compact, high-pin package: The 256-FPBGA (17×17 mm) package provides substantial I/O density in a small board footprint to reduce PCB area.
• Industrial temperature capability: Rated for −40 °C to 100 °C operation for deployment in demanding environments where extended temperature tolerance is required.
• Low-voltage core compatibility: 1.14 V to 1.26 V supply range aligns with modern low-voltage system architectures.
• Balanced logic and memory: 3,100 logic elements and 56,320 bits of on-chip RAM enable a wide range of control, interface, and glue-logic tasks without external SRAM for many designs.
• RoHS compliant: Supports environmentally compliant manufacturing and procurement requirements.
• Backed by LatticeECP2/M family architecture: Family-level design attributes provide documented building blocks for clocking, DSP, and memory resources to help accelerate implementation.

Why Choose LFEC3E-4F256I?

The LFEC3E-4F256I combines a practical balance of logic capacity, I/O availability, and on-chip memory in a compact 256-FPBGA package suited to industrial and embedded applications. Its low-voltage core and industrial temperature rating make it appropriate for systems requiring robust operation across extended conditions.

This device is a fit for engineers and procurement teams seeking a reliable, small-footprint FPGA platform for control logic, interface bridging, and custom digital functions—while retaining the benefits of the LatticeECP2/M family architecture for design continuity and ecosystem support.

If you would like pricing, availability, or to request a quote for LFEC3E-4F256I, please submit a request or quote through your preferred procurement channel.