LFEC3E-3TN100C

IC FPGA 67 I/O 100TQFP
Part Description

EC Field Programmable Gate Array (FPGA) IC 67 56320 3100 100-LQFP

Quantity 596 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O67Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3100
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits56320

Overview of LFEC3E-3TN100C – EC Field Programmable Gate Array (FPGA) IC 67 56320 3100 100-LQFP

The LFEC3E-3TN100C is a commercial-grade FPGA from Lattice Semiconductor’s LatticeECP/EC family. It implements a low-cost FPGA fabric optimized for mainstream applications, combining programmable logic, embedded memory, and flexible I/O to enable compact, configurable designs.

With approximately 3,100 logic elements and roughly 56 Kbits of on-chip RAM, this device targets embedded systems, communications and consumer applications that require moderate logic density, a 67-pin I/O footprint, and surface-mount 100-pin LQFP packaging.

Key Features

  • Logic Capacity  Approximately 3,100 logic elements and 384 logic clusters, enabling medium-density logic implementations.
  • Embedded Memory  Total on-chip RAM of 56,320 bits (approximately 56 Kbits) for distributed and block memory use in state machines, buffering, and small data stores.
  • I/O  67 user I/Os provided in the 100-pin package to support a range of peripheral interfaces and board-level connectivity.
  • Flexible I/O Standards (family-level)  Family documentation indicates programmable I/O buffers that support common standards including multiple LVCMOS voltages, LVTTL, SSTL, HSTL and differential I/O options for versatile interfacing.
  • Clocking  Family information specifies up to two PLLs for the LFEC3 family, providing clock multiplication, division and phase-shifting capabilities for system timing.
  • Power  Core supply operating range from 1.14 V to 1.26 V to meet device power requirements.
  • Package & Mounting  100-pin LQFP package; supplier lists 100-TQFP (14 × 14 mm). Device is supplied for surface-mount assembly.
  • Operating Conditions  Commercial grade operating temperature range: 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • Embedded Control  Use as a programmable logic engine for control, sequencing and glue-logic functions in embedded devices where medium logic density and compact packaging are required.
  • Communications Equipment  Implement interface bridging, protocol adaptation or custom peripheral logic leveraging 67 I/Os and the family’s programmable I/O standards.
  • Consumer Electronics  Integrate custom feature logic, user-interface control, and small buffering tasks while maintaining a low-cost BOM and surface-mount package.
  • Memory Interface and Prototyping  Leverage the family’s dedicated DDR memory support and on-chip memory for prototyping memory-related interfaces and system-level validation.

Unique Advantages

  • Balanced Logic and Memory  Approximately 3,100 logic elements paired with roughly 56 Kbits of on-chip RAM provides a practical balance for mainstream designs without excess capacity.
  • Compact, Surface-Mount Package  100-pin LQFP/TQFP packaging (14 × 14 mm supplier footprint) reduces board area while providing a generous set of I/Os for mixed-signal and digital peripherals.
  • Flexible I/O Options  Family-level programmable I/O supports a broad set of standards, simplifying board-level interface design and enabling reuse across multiple designs.
  • Deterministic Supply Requirements  A narrow core supply range (1.14 V–1.26 V) simplifies power rail design and qualification within target systems.
  • Commercial-Grade Thermal Range  Specified 0 °C to 85 °C operating range aligns with many consumer and communications deployments.
  • RoHS Compliance  Meets lead-free and restricted-substance directives to support modern manufacturing processes.

Why Choose LFEC3E-3TN100C?

The LFEC3E-3TN100C delivers a practical combination of logic capacity, embedded memory and flexible I/O in a compact 100-pin surface-mount package. It is positioned for designers who need a cost-conscious, configurable FPGA solution for embedded, communications and consumer applications where medium-density logic and a controlled power envelope are important.

Supported by the LatticeECP/EC family architecture, the device benefits from family-level capabilities such as programmable I/O standards, PLL-based clock management and dedicated memory interface support, making it a suitable building block for scalable prototypes and production designs that require predictable, verifiable specifications.

If you would like pricing, availability or a formal quote for LFEC3E-3TN100C, submit a request and our team will respond with the next steps.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up