LFEC3E-3TN100C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 67 56320 3100 100-LQFP |
|---|---|
| Quantity | 596 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 67 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3100 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFEC3E-3TN100C – EC Field Programmable Gate Array (FPGA) IC 67 56320 3100 100-LQFP
The LFEC3E-3TN100C is a commercial-grade FPGA from Lattice Semiconductor’s LatticeECP/EC family. It implements a low-cost FPGA fabric optimized for mainstream applications, combining programmable logic, embedded memory, and flexible I/O to enable compact, configurable designs.
With approximately 3,100 logic elements and roughly 56 Kbits of on-chip RAM, this device targets embedded systems, communications and consumer applications that require moderate logic density, a 67-pin I/O footprint, and surface-mount 100-pin LQFP packaging.
Key Features
- Logic Capacity Approximately 3,100 logic elements and 384 logic clusters, enabling medium-density logic implementations.
- Embedded Memory Total on-chip RAM of 56,320 bits (approximately 56 Kbits) for distributed and block memory use in state machines, buffering, and small data stores.
- I/O 67 user I/Os provided in the 100-pin package to support a range of peripheral interfaces and board-level connectivity.
- Flexible I/O Standards (family-level) Family documentation indicates programmable I/O buffers that support common standards including multiple LVCMOS voltages, LVTTL, SSTL, HSTL and differential I/O options for versatile interfacing.
- Clocking Family information specifies up to two PLLs for the LFEC3 family, providing clock multiplication, division and phase-shifting capabilities for system timing.
- Power Core supply operating range from 1.14 V to 1.26 V to meet device power requirements.
- Package & Mounting 100-pin LQFP package; supplier lists 100-TQFP (14 × 14 mm). Device is supplied for surface-mount assembly.
- Operating Conditions Commercial grade operating temperature range: 0 °C to 85 °C.
- Regulatory RoHS compliant.
Typical Applications
- Embedded Control Use as a programmable logic engine for control, sequencing and glue-logic functions in embedded devices where medium logic density and compact packaging are required.
- Communications Equipment Implement interface bridging, protocol adaptation or custom peripheral logic leveraging 67 I/Os and the family’s programmable I/O standards.
- Consumer Electronics Integrate custom feature logic, user-interface control, and small buffering tasks while maintaining a low-cost BOM and surface-mount package.
- Memory Interface and Prototyping Leverage the family’s dedicated DDR memory support and on-chip memory for prototyping memory-related interfaces and system-level validation.
Unique Advantages
- Balanced Logic and Memory Approximately 3,100 logic elements paired with roughly 56 Kbits of on-chip RAM provides a practical balance for mainstream designs without excess capacity.
- Compact, Surface-Mount Package 100-pin LQFP/TQFP packaging (14 × 14 mm supplier footprint) reduces board area while providing a generous set of I/Os for mixed-signal and digital peripherals.
- Flexible I/O Options Family-level programmable I/O supports a broad set of standards, simplifying board-level interface design and enabling reuse across multiple designs.
- Deterministic Supply Requirements A narrow core supply range (1.14 V–1.26 V) simplifies power rail design and qualification within target systems.
- Commercial-Grade Thermal Range Specified 0 °C to 85 °C operating range aligns with many consumer and communications deployments.
- RoHS Compliance Meets lead-free and restricted-substance directives to support modern manufacturing processes.
Why Choose LFEC3E-3TN100C?
The LFEC3E-3TN100C delivers a practical combination of logic capacity, embedded memory and flexible I/O in a compact 100-pin surface-mount package. It is positioned for designers who need a cost-conscious, configurable FPGA solution for embedded, communications and consumer applications where medium-density logic and a controlled power envelope are important.
Supported by the LatticeECP/EC family architecture, the device benefits from family-level capabilities such as programmable I/O standards, PLL-based clock management and dedicated memory interface support, making it a suitable building block for scalable prototypes and production designs that require predictable, verifiable specifications.
If you would like pricing, availability or a formal quote for LFEC3E-3TN100C, submit a request and our team will respond with the next steps.

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