LFEC3E-3T144C

The LFEC3E-3T144C is a commercial-grade field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It provides a mid-range logic capacity and on-chip RAM in a 144-LQFP surface-mount package targeted at commercial embedded designs requiring flexible, reconfigurable logic and broad I/O connectivity.

With a core supply range of 1.14 V to 1.26 V and an ambient operating range of 0 °C to 85 °C, this device suits a variety of general-purpose commercial applications that need moderate logic resources and dense I/O in a compact footprint.

Key Features

• Logic Capacity — Approximately 3,100 logic elements and 384 logic blocks provide mid-range programmability for glue logic, protocol adaptation, and custom control functions.
• Embedded Memory — 56,320 bits of on-chip RAM suitable for small buffers, FIFOs, and state storage within custom logic designs.
• I/O Density — 97 available I/O pins enable interfacing to multiple peripherals, buses, and sensors without external I/O expanders.
• Power — Core supply range of 1.14 V to 1.26 V to match system power architectures that use low-voltage FPGA cores.
• Package & Mounting — 144-LQFP (supplier device package 144-TQFP, 20 × 20 mm) in a surface-mount form factor for standard PCB assembly processes.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial environments.
• Environmental Compliance — RoHS compliant to meet common regulatory requirements for lead-free assemblies.

Typical Applications

• Prototyping and Development — Use as a reprogrammable platform for validating logic, interfaces, and system control functions during development cycles.
• Interface Bridging — Implement protocol translation, parallel-to-serial interface logic, or custom bus adapters leveraging the 97 I/O signals.
• Embedded Control — Integrate custom control state machines and peripheral management for commercial embedded products requiring moderate logic and local SRAM.
• Signal Conditioning and Glue Logic — Offload glue logic, timing alignment, and simple datapath tasks from a main processor using the device’s logic elements and on-chip RAM.

Unique Advantages

• Balanced Logic and Memory — The combination of ~3,100 logic elements and 56,320 bits of RAM provides a compact solution for designs that need both logic density and local buffering.
• High I/O Count in a Compact Package — 97 I/Os in a 144-LQFP footprint allow significant peripheral connectivity without a large package or multiple devices.
• Surface-Mount, Production-Friendly Package — 144-LQFP (20 × 20 mm) surface-mount package supports common PCB assembly and reflow processes for commercial manufacturing.
• Commercial Temperature Suitability — Rated 0 °C to 85 °C to align with typical commercial electronics operating environments.
• RoHS Compliant — Supports lead-free assembly and regulatory compliance for modern product designs.

Why Choose LFEC3E-3T144C?

The LFEC3E-3T144C offers a practical balance of logic elements, embedded RAM, and I/O density in a compact 144-LQFP package for commercial embedded systems. It is well suited for designers who need moderate reprogrammable logic, multiple peripheral interfaces, and a surface-mount form factor that fits standard production processes.

This Lattice Semiconductor FPGA is a fit for projects that require scalable, reconfigurable logic resources without moving to larger, higher-cost families—providing a clear option for integration into commercial product lines and development platforms.

Request a quote or submit an inquiry to purchase the LFEC3E-3T144C and get pricing and lead-time information for your project needs.