LFEC3E-3QN208I

The LFEC3E-3QN208I is an EC-family Field Programmable Gate Array (FPGA) optimized for mainstream, cost-sensitive embedded applications. It integrates approximately 3,100 logic elements with flexible on-chip memory and a high I/O count to support I/O‑rich system designs.

Built for industrial operating ranges and low-voltage core operation, this device targets applications requiring robust I/O, embedded memory resources and system-level features such as programmable PLLs and boundary-scan support.

Key Features

• Logic Fabric  Approximately 3,100 logic elements (≈3.1K LUTs) suitable for mid-density logic implementations.
• Embedded and Distributed Memory  Approximately 55 Kbits of embedded block RAM (EBR) plus family-supported distributed RAM (LFEC3 family shows ~12 Kbits), enabling mixed block and distributed memory use in designs.
• I/O Density & Flexibility  145 programmable I/O pins in a 208‑pin package to support multiple external interfaces and high pin-count designs.
• Clocking  Two analog PLLs provide clock multiply/divide and phase shifting for flexible clocking architectures (LFEC3 family).
• Dedicated Memory Interface Support  Family-level support for dedicated DDR memory interfaces is provided to implement external DDR interfaces when required.
• Package & Mounting  208‑BFQFP (208‑pin, 28×28 mm supplier package) in a surface-mount form factor for standard PCB assembly.
• Voltage & Temperature  Core supply range of 1.14 V to 1.26 V; industrial operating temperature range from −40 °C to 100 °C.
• System-Level Support  Family features include boundary-scan, SPI boot flash interface and internal logic analysis capabilities to assist development and system integration.
• Compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  Industrial-grade temperature rating and extensive I/O make the device suitable for sensor aggregation, I/O expansion and control logic in factory or process automation.
• Communications and networking  High I/O count and flexible I/O standards (as supported by the family) enable protocol bridging, interface adaptation and packet-handling functions in network equipment.
• Embedded systems  Mid-density logic capacity with on-chip RAM and PLL resources supports custom glue logic, peripheral controllers and system glue for cost-sensitive embedded products.

Unique Advantages

• Balanced mid-range capacity  Combines ~3,100 logic elements with embedded RAM to address a wide range of mid-density designs without unnecessary overhead.
• High I/O count in a compact package  145 I/Os in a 208‑pin BFQFP package simplifies board-level routing for I/O-intensive applications while using a standard surface-mount form factor.
• Industrial temperature support  Rated from −40 °C to 100 °C for deployment in industrial environments where extended temperature range is required.
• Flexible clocking and memory interfaces  Two PLLs and family-level DDR interface support enable adaptable timing schemes and external memory integration.
• Development and system support  Boundary-scan, SPI boot and internal logic analysis features in the family streamline bring-up and debugging.

Why Choose LFEC3E-3QN208I?

The LFEC3E-3QN208I positions itself as a practical mid-density FPGA choice for teams needing a balance of logic capacity, on-chip memory and extensive I/O within an industrial temperature envelope. Its low‑voltage core operation, surface-mount 208‑BFQFP package and system-level features support a variety of embedded designs that require reliable interfacing and flexible clock/memory options.

This device is well suited to engineers and procurement teams building cost-sensitive, I/O-rich systems who value predictable power, industrial operating range and the design support features provided by the Lattice EC family.

Request a quote or submit a pricing inquiry to check availability and lead times for the LFEC3E-3QN208I.