LFEC3E-3T144I

The LFEC3E-3T144I is an EC Field Programmable Gate Array (FPGA) IC supplied in a 144-pin LQFP package. It provides 3,100 logic elements, approximately 56,320 bits of on-chip RAM, and 97 general-purpose I/Os in a surface-mount footprint.

Designed for industrial-temperature operation, this device targets designs that require moderate logic capacity, significant I/O counts, and compact package integration while operating from a low-voltage supply between 1.14 V and 1.26 V.

Key Features

• Core Capacity  3,100 logic elements provide a balanced resource set for custom digital functions and moderate-complexity designs.
• Embedded Memory  Total on-chip RAM of 56,320 bits supports data buffering and small lookup-table requirements without external memory.
• High I/O Count  Ninety-seven user I/Os offer flexibility for interfacing to peripherals, sensors, and external logic devices.
• Low-Voltage Operation  Specified supply range from 1.14 V to 1.26 V for designs targeting low-voltage domains.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to meet industrial ambient requirements.
• Package & Mounting  Supplied in a 144-LQFP (supplier package: 144-TQFP, 20 × 20) surface-mount package for compact board-level integration.
• Compliance  RoHS compliant for adherence to common environmental requirements.

Typical Applications

• Custom digital logic  Implement control, glue logic, and small-scale combinational/sequential functions using 3,100 logic elements and on-chip RAM.
• Multi-I/O interface bridging  Use the 97 I/Os to connect and translate between multiple peripheral or sensor interfaces on compact PCBs.
• Industrial embedded modules  Deploy in temperature-challenging environments where the –40 °C to 100 °C rating and industrial grade are required.

Unique Advantages

• Moderate logic density:  3,100 logic elements strike a balance between capability and footprint for mid-level programmable functions.
• Integrated RAM resources:  56,320 bits of on-chip memory reduce the need for external RAM in many buffering and LUT use cases.
• Flexible I/O count:  Ninety-seven I/Os enable multi-device interfacing and parallel control without immediate expansion hardware.
• Industrial temperature support:  –40 °C to 100 °C rating supports deployment in demanding ambient conditions.
• Compact surface-mount package:  144-LQFP (144-TQFP, 20 × 20) offers a compact form factor for space-constrained board layouts.
• RoHS compliance:  Environmentally compliant construction simplifies regulatory handling for most markets.

Why Choose LFEC3E-3T144I?

The LFEC3E-3T144I combines a practical logic capacity, on-chip memory, and a high I/O count in a compact 144-LQFP surface-mount package rated for industrial temperatures. Its specifications make it well suited for designers seeking a moderate-density FPGA solution that fits space- and thermal-constrained boards while operating from a low-voltage supply.

Choose this device when your design requires a balance of integration, I/O flexibility, and industrial-grade environmental tolerance, with RoHS compliance for streamlined procurement and manufacturing.

Request a quote or submit a purchase inquiry today to evaluate the LFEC3E-3T144I for your next design.