LFEC3E-3TN144C

The LFEC3E-3TN144C is a commercial-grade EC (EConomy) FPGA from Lattice Semiconductor, part of the LatticeECP/EC family. It provides mid-range logic integration in a compact 144-pin package for cost-sensitive embedded designs.

This device offers approximately 3,100 logic elements, roughly 56 Kbits of on-chip RAM, and 97 user I/Os, making it suitable for interfacing, control and mid-density logic functions where compact packaging and RoHS compliance are required.

Key Features

• Logic Capacity  Approximately 3,100 logic elements (logic cells) for mid-range combinational and sequential logic integration.
• On-chip Memory  Total RAM capacity of 56,320 bits (approximately 56 Kbits) for embedded data storage and buffers.
• I/O  97 user I/Os provide flexible external connectivity for peripherals, sensors and interfaces.
• Clocking  Device-level support includes two PLLs for clock multiplication, division and phase adjustment (family specification).
• Voltage Supply  Nominal operating supply range from 1.14 V to 1.26 V, compatible with a 1.2 V FPGA supply ecosystem.
• Package & Mounting  144-LQFP surface-mount package (supplier device package: 144-TQFP, 20×20 mm) for standard PCB assembly.
• Operating Range  Commercial temperature grade: 0 °C to 85 °C for typical commercial applications.
• Standards & I/O Flexibility (family-level)  LatticeECP/EC family I/O buffer options support a wide range of signaling standards across common voltage levels, enabling interface flexibility for many designs.
• Compliance  RoHS compliant for environmental and manufacturing requirements.
• Design Tool & IP Support (family-level)  Supported by the ispLEVER design tool suite and available ispLeverCORE IP modules for streamlined implementation and design reuse.

Typical Applications

• Consumer and Commercial Electronics  Control and glue-logic duties in consumer devices where a compact, surface-mount FPGA with moderate I/O and memory is required.
• Embedded Control & Sensor Interfaces  Integration of sensor inputs, peripheral bridging and local processing using the device’s I/Os and embedded memory.
• Prototyping and Development  Mid-density FPGA resource suitable for proof-of-concept and product development within commercial temperature ranges.
• Communications and Peripherals  Interface logic, protocol adaptation and buffering for moderate-speed communications links leveraging flexible I/O options.

Unique Advantages

• Mid-range Logic Integration:  About 3,100 logic elements provide a balance between capacity and cost for mainstream designs.
• Compact Surface-Mount Package:  144-LQFP (20×20 mm) package reduces PCB footprint while retaining ample I/O for peripheral connectivity.
• Flexible I/O and Clocking:  Family-level I/O standard support plus two PLLs enable adaptable interfacing and clock management for many applications.
• RoHS-Compliant Manufacturing:  Meets environmental compliance requirements for modern production flows.
• Toolchain and IP Ecosystem:  Designed for use with ispLEVER and ispLeverCORE IP, helping shorten development cycles and enable design reuse.
• Commercial Temperature Suitability:  Rated 0 °C to 85 °C to match typical commercial deployment conditions.

Why Choose LFEC3E-3TN144C?

The LFEC3E-3TN144C positions itself as a cost-conscious, mid-density FPGA option within the LatticeECP/EC family. It combines roughly 3,100 logic elements, approximately 56 Kbits of on-chip RAM and 97 I/Os in a compact 144-pin surface-mount package—delivering a practical balance of integration and board-level footprint for commercial embedded designs.

Backed by family-level features such as flexible I/O standards, PLL-based clocking and support in the ispLEVER tool suite with available ispLeverCORE IP, this device is well suited for teams seeking an FPGA that supports density migration and streamlined design flows within mainstream applications.

Request a quote or submit a purchase inquiry to get pricing and availability for the LFEC3E-3TN144C.