LFEC3E-3TN144I

The LFEC3E-3TN144I is an Lattice Semiconductor EC-family FPGA offered in a 144-pin LQFP surface-mount package. It integrates approximately 3,100 logic elements, about 56 Kbits of on-chip RAM and 97 I/O pins to address mid-density, cost-sensitive programmable logic applications. The device targets industrial-temperature deployments and provides a compact, low-voltage FPGA building block for control, interfacing and system glue logic.

Key Features

• Logic Capacity 
  Approximately 3,100 logic elements suitable for mid-density combinational and sequential logic integration.
• On‑chip Memory 
  Total on-chip RAM of approximately 56,320 bits to support distributed memory and small embedded data buffers.
• I/O and Package 
  97 I/O pins in a 144-LQFP (20 × 20 mm) surface-mount package for versatile board-level connectivity.
• Power Supply 
  Specified core supply range of 1.14 V to 1.26 V to match low-voltage system power rails.
• Operating Temperature 
  Industrial-grade operating range from −40 °C to 100 °C for use in temperature-challenging environments.
• PLL Resources (Family) 
  LFEC3 family devices include 2 PLLs for clock multiplication, division and phase control (family-level capability).
• Family I/O Flexibility 
  The LatticeECP/EC family supports a flexible sysI/O buffer architecture with wide interface options including LVCMOS, LVTTL, SSTL, HSTL and differential standards (family-level feature).
• RoHS Compliant 
  Manufactured to meet RoHS requirements for environmental compliance.

Typical Applications

• Industrial Control 
  Compact, industrial-temperature FPGA for implementing control logic, state machines and custom peripheral interfaces on factory and process equipment.
• Interface Bridging 
  Use as a protocol or pin-count bridge to translate between microcontrollers, sensors and peripherals while consolidating glue logic.
• Embedded System Prototyping 
  Platform for rapid hardware prototyping of mid-density designs where reprogrammability and I/O flexibility are required.

Unique Advantages

• Right‑sized Logic and Memory: The combination of ~3,100 logic elements and ~56 Kbits of RAM provides a balanced resource set for mid-density designs without excess cost or board area.
• Compact Surface‑Mount Package: 144-LQFP (20 × 20 mm) package offers a compact footprint with 97 I/Os for space-constrained PCBs.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployments in harsher ambient conditions.
• Low‑Voltage Core: Narrow supply range (1.14 V–1.26 V) enables integration into low-voltage systems and simplifies power-rail design.
• Family-Level I/O and Clock Features: Access to the LatticeECP/EC family’s flexible I/O standards and PLL capabilities helps adapt interfaces and clocking without external components (family-level benefits).
• Regulatory Compliance: RoHS compliance supports environmentally conscious designs and manufacturing workflows.

Why Choose LFEC3E-3TN144I?

The LFEC3E-3TN144I delivers a practical balance of logic capacity, on-chip memory and I/O count in a compact 144-LQFP package, optimized for mid-density programmable applications in industrial environments. Its low-voltage core and family-level I/O/clock capabilities make it suitable where board space, power efficiency and flexible interfacing drive design decisions.

This device is a fit for design teams and procurement seeking a cost-effective FPGA solution that integrates common system functions while leveraging Lattice’s ecosystem and family features for predictable migration and reuse across similar designs.

Request a quote or submit a purchase inquiry to get pricing and availability for the LFEC3E-3TN144I.