LFEC3E-4FN256I

The LFEC3E-4FN256I is an EC family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a general-purpose FPGA fabric based on LUT‑style logic with embedded and distributed memory, designed for mainstream and cost‑sensitive applications that require moderate logic capacity and flexible I/O.

With 3,100 logic elements, approximately 56,320 bits of on‑chip RAM, and 160 user I/O in a 256‑ball fpBGA (17 × 17 mm) package, this industrial‑grade device offers an integrated platform for embedded systems, industrial control, and memory‑interface designs operating across a wide temperature range.

Key Features

• Core architecture  LUT‑based logic fabric with support for distributed and embedded memory and integrated PLLs, delivering standard FPGA capabilities used in mainstream designs.
• Logic capacity  Approximately 3,100 logic elements suitable for mid‑range digital designs and glue logic integration.
• On‑chip memory  Total on‑chip RAM of 56,320 bits (approximately 56 Kbits) providing both distributed and embedded memory resources for data buffering and state storage.
• I/O and package  160 user I/O pins in a 256‑ball fpBGA (17 × 17 mm) surface‑mount package for compact board-level integration.
• Power supply  Nominal core supply range of 1.14 V to 1.26 V to match single‑rail low‑voltage system architectures.
• Industrial temperature and grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for reliable operation in demanding environments.
• System‑level support  Includes IEEE 1149.1 boundary scan, SPI boot flash interface and ispTRACY internal logic analyzer capability for debugging and production test.
• Dedicated memory interface  Family‑level support includes dedicated DDR memory interface logic to simplify integration with external DDR memory systems.
• Compliance  RoHS compliant.
• Design ecosystem  Supported by the family design tool flow and pre‑designed IP modules to accelerate development and reduce time to prototype.

Typical Applications

• Embedded systems  Use as a mid‑density programmable fabric for control, signal aggregation, and interface logic in embedded products.
• Industrial control  Industrial‑grade temperature range and robust I/O make the device suitable for automation, motor control interfaces, and factory equipment logic.
• Memory interface and buffering  Built‑in DDR interface logic and on‑chip RAM enable buffering and bridging roles between processors and external memory.
• System integration and test  Boundary scan, SPI boot, and ispTRACY support streamline board bring‑up, debugging, and manufacturing test flows.
• Cost‑sensitive digital logic  Balanced logic capacity and on‑chip resources provide a low‑cost FPGA option for mainstream applications requiring configurable logic and I/O.

Unique Advantages

• Balanced logic and memory  Combines roughly 3,100 logic elements with ~56 Kbits of embedded RAM to handle control logic, state machines, and modest data buffering without external SRAM for many use cases.
• Compact, high‑density I/O  160 I/O in a 256‑ball fpBGA (17 × 17 mm) package minimizes board footprint while enabling multiple peripheral interfaces.
• Industrial reliability  Rated for −40 °C to 100 °C operation and specified as industrial grade for deployments in harsher environments.
• Low‑voltage core  1.14 V to 1.26 V core supply range supports low‑power system architectures and modern power rails.
• System and test features  Built‑in boundary scan, SPI boot flash interface and internal logic analyzer capability reduce development and production test time.
• RoHS compliant  Meets RoHS requirements for environmentally conscious designs.

Why Choose LFEC3E-4FN256I?

The LFEC3E-4FN256I positions itself as a practical, general‑purpose FPGA for engineers seeking a mid‑density, industrial‑grade device with a balanced mix of logic, embedded memory, and I/O. Its combination of approximately 3,100 logic elements, ~56 Kbits of on‑chip RAM, 160 user I/O and a compact 256‑ball fpBGA package makes it well suited to embedded control, industrial automation, and designs that require reliable operation across a wide temperature range.

Backed by the family’s design ecosystem and system‑level features—such as boundary scan, SPI boot support and internal logic analysis—the LFEC3E-4FN256I supports efficient development, board bring‑up and production testing while helping reduce overall BOM complexity.

Request a quote or submit a pricing inquiry today to receive current availability and ordering information for the LFEC3E-4FN256I.