LFEC3E-4FN256C

The LFEC3E-4FN256C is a commercial-grade EC-family field programmable gate array (FPGA) in a 256-ball fpBGA package. It provides a low-voltage core with a mid-range logic capacity and integrated memory, suited for mainstream FPGA roles that require flexible I/O and on-chip RAM.

Built on the Lattice EC architecture, the device combines LUT-based logic, distributed and embedded memory resources, and standard FPGA system features to address general-purpose embedded and interface applications.

Key Features

• Logic Capacity — 3,100 logic elements (approx. 3.1K LUT-based logic elements) to implement medium-complexity logic and control functions.
• On-Chip Memory — Total on-chip RAM: 56,320 bits (approximately 55 Kbits) of embedded memory for buffering, FIFOs and small data tables.
• I/O Density & Flexibility — 160 I/Os available; family support for a wide range of interfaces and I/O standards enables flexible board-level connectivity.
• Power — Core supply range 1.14 V to 1.26 V (nominal 1.2 V operation), enabling low-voltage system integration.
• Packaging — 256-ball fpBGA (17 × 17 mm) surface-mount package for high-density board layouts.
• Operating Range — Commercial temperature grade: 0 °C to 85 °C.
• System Features — Family-level architecture includes distributed and block memory, PLL-based clocking resources, and support for SPI boot flash and IEEE 1149.1 boundary scan.
• Compliance — RoHS compliant.

Typical Applications

• Embedded system control — Implement control logic, state machines and glue logic for consumer and industrial electronics using the device's mid-range logic and I/O resources.
• Interface bridging and protocol translation — Use the flexible I/O support and on-chip memory for buffering and adapting between different peripheral interfaces.
• Memory interface and buffering — On-chip RAM and family-level DDR interface support enable local buffering and intermediate data storage in cost-sensitive designs.
• Prototyping and proof-of-concept designs — Mid-range capacity and commercial-grade temperature make the device suitable for functional prototyping and early product iterations.

Unique Advantages

• Balanced mid-range resources — Approximately 3.1K logic elements combined with ~55 Kbits of embedded RAM provide a practical balance of logic and memory for mainstream designs.
• Flexible I/O and interface support — 160 I/Os and family-level programmable I/O buffers enable a wide range of signaling standards and board-level connectivity options.
• Compact, board-friendly package — 256-ball fpBGA (17 × 17 mm) package offers a dense footprint for space-constrained PCBs while retaining ample I/O.
• Low-voltage core — 1.14 V to 1.26 V supply range aligns with modern low-voltage system power rails for efficient integration.
• Commercial-grade reliability — Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.

Why Choose LFEC3E-4FN256C?

The LFEC3E-4FN256C positions itself as a practical EC-family FPGA option for engineers needing a mid-range programmable device with flexible I/O, on-chip memory and a compact fpBGA package. Its combination of roughly 3.1K logic elements, ~55 Kbits of embedded RAM and 160 I/Os makes it suitable for mainstream embedded control, interface bridging and moderate buffering tasks.

Designed within the Lattice EC family framework, this device is a fit for teams seeking predictable, commercial-grade performance with accessible system features (PLL clocking, on-chip memory and boundary-scan support) and a low-voltage core for efficient board integration.

If you would like pricing, availability or a formal quote for the LFEC3E-4FN256C, request a quote or submit your procurement requirements and our team will respond with next steps.