LFEC3E-3T100I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 67 56320 3100 100-LQFP |
|---|---|
| Quantity | 859 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 67 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3100 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFEC3E-3T100I – EC Field Programmable Gate Array (FPGA) IC, 100-LQFP
The LFEC3E-3T100I is an EC Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation supplied in a 100-pin LQFP package. The device integrates 3,100 logic elements and approximately 56 kbits of on-chip RAM, providing a compact, industrial-grade programmable logic option for embedded designs.
With 67 available I/O pins, surface-mount packaging, a low-voltage supply range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C, this FPGA targets industrial applications that require moderate logic density, flexible I/O and reliable operation across extended temperature ranges.
Key Features
- Core Logic 3,100 logic elements for implementing custom digital logic and control functions within a compact FPGA footprint.
- Embedded Memory Approximately 56 kbits (56,320 bits) of on-chip RAM to support buffering, state machines and small data storage needs.
- I/O Capacity 67 general-purpose I/Os to interface with peripherals, sensors and external logic in mixed-signal systems.
- Power Low-voltage supply operation from 1.14 V to 1.26 V suitable for designs with tight power budgets and modern low-voltage domains.
- Package & Mounting Available in a 100-LQFP package (supplier device package: 100-TQFP, 14 × 14 mm) and designed for surface-mount assembly.
- Temperature & Grade Industrial-grade device rated for operation from -40 °C to 100 °C for use in environments with extended temperature requirements.
- Regulatory RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Industrial Control – Use where industrial temperature ratings and a mix of logic and I/O are needed for control, monitoring or interface tasks.
- Embedded Logic and Glue – Implement protocol bridging, glue logic and custom control functions within compact PCB layouts thanks to the 100-LQFP package and surface-mount mounting.
- Prototyping and Evaluation – Small to mid-scale FPGA designs that require 3,100 logic elements and on-chip RAM for developing and validating embedded logic.
Unique Advantages
- Balanced Logic and Memory: 3,100 logic elements paired with approximately 56 kbits of RAM provide a practical combination for mid-density designs without excessive board area.
- Ample I/O Count: 67 I/Os enable direct interfacing to multiple peripherals and sensors, reducing the need for external I/O expanders.
- Industrial Temperature Rating: Rated from -40 °C to 100 °C to support deployed equipment that must tolerate wide temperature swings.
- Low-Voltage Operation: Narrow supply range of 1.14 V to 1.26 V allows integration into low-voltage system domains.
- Compact Surface-Mount Package: 100-LQFP (100-TQFP, 14 × 14 mm) package supports dense PCB layouts and standard assembly processes.
- RoHS Compliant: Meets common environmental compliance requirements for modern electronics manufacturing.
Why Choose LFEC3E-3T100I?
The LFEC3E-3T100I offers a practical, industrial-grade FPGA option for engineers needing a moderate number of logic elements, on-chip RAM and a substantial I/O count in a compact surface-mount package. Backed by Lattice Semiconductor Corporation, the device is positioned for embedded designs that require reliable operation across an extended temperature range and low-voltage system compatibility.
This part is well suited to teams building industrial control systems, embedded prototypes or applications requiring flexible I/O and solid integration while maintaining a small board footprint and RoHS compliance.
Request a quote or submit an inquiry to check availability and pricing for the LFEC3E-3T100I and to discuss your application requirements with our team.

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