LFEC3E-3Q208I

The LFEC3E-3Q208I is an EC Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation offered in a 208-BFQFP surface-mount package. It provides a mid-density programmable logic solution with abundant I/O and on-chip memory suited for industrial applications that require configurable digital logic and interface consolidation.

Featuring 3,100 logic elements, approximately 56.3 kbits of embedded RAM and 145 I/O pins, this device targets designs that need flexible logic resources, significant I/O count and reliable operation across an industrial temperature range.

Key Features

• Logic Resources — 3,100 logic elements and 384 logic blocks support a variety of custom digital functions and moderate complexity designs.
• Embedded Memory — Approximately 56.3 kbits of on-chip RAM for buffering, small data stores and control-state storage within the FPGA fabric.
• I/O Capacity — 145 user I/Os enable dense external connectivity for sensors, interfaces, and peripheral devices.
• Power — Low-voltage core operation with a supply range of 1.14 V to 1.26 V for the programmable fabric.
• Package & Mounting — Surface-mount 208-BFQFP package (supplier device package: 208-PQFP, 28 × 28 mm) for compact board-level integration.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C for use in demanding environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control & Automation — Uses include custom logic for control loops, I/O expansion and interface bridging in industrial systems, leveraging the industrial temperature rating and substantial I/O count.
• Embedded System Glue Logic — Integrates disparate digital peripherals and custom protocols where 3,100 logic elements and on-chip RAM provide flexible implementation of control and data paths.
• Sensor Aggregation & Preprocessing — Consolidates multiple sensor inputs across many I/Os and performs local logic-level preprocessing before passing data to host processors.

Unique Advantages

• Balanced Logic Density: 3,100 logic elements offer a middle-ground capacity for moderately complex programmable designs without excessive resource overhead.
• High I/O Count: With 145 I/Os, the device simplifies designs that require extensive external connectivity, reducing the need for additional interface chips.
• Compact Surface-Mount Package: The 208-BFQFP (208-PQFP, 28 × 28 mm) package enables a high pin count in a board-friendly surface-mount format.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in harsher operating environments.
• Low-Voltage Core: Core supply of 1.14 V to 1.26 V supports designs targeting lower power consumption at the fabric level.
• Regulatory Compliance: RoHS compliance for environmental and manufacturing considerations.

Why Choose LFEC3E-3Q208I?

The LFEC3E-3Q208I positions itself as a practical, industrial-grade FPGA option for designs that require a moderate amount of programmable logic, substantial I/O capability and on-chip memory in a compact surface-mount package. Its operating voltage and temperature range make it suited to embedded and industrial applications where reliable operation and high connectivity are required.

Designed and manufactured by Lattice Semiconductor Corporation, this device is a fit for engineers and procurement teams looking for a configurable logic solution that balances integration, I/O density and environmental robustness for medium-complexity designs.

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