LFEC3E-3F256I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 160 56320 3100 256-BGA |
|---|---|
| Quantity | 592 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 160 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3100 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFEC3E-3F256I – EC Field Programmable Gate Array (FPGA) IC 160 56320 3100 256-BGA
The LFEC3E-3F256I is an industrial-grade field programmable gate array (FPGA) delivered in a 256-ball BGA package. It provides a mid-range logic capacity and embedded RAM suitable for embedded control and interface tasks in temperature-demanding environments.
With 3,100 logic elements, 56,320 bits of on-chip RAM, and 160 I/O pins, this device targets designs that require moderate logic density, flexible I/O connectivity, and operation across an extended industrial temperature range.
Key Features
- Logic Capacity Approximately 3,100 logic elements to implement control, glue-logic, and moderate complexity state machines.
- Embedded Memory Total on-chip RAM of 56,320 bits (approximately 0.056 Mbits) for data buffering and small lookup tables.
- I/O Resources 160 general-purpose I/O pins to support parallel interfaces, sensor connections, and control signals.
- Power Core supply range from 1.14 V to 1.26 V for systems designed to this voltage envelope.
- Package & Mounting 256-ball FPBGA package (256-FPBGA, 17×17) in a surface-mount form factor for compact PCB integration.
- Temperature Range Industrial operating temperature from −40 °C to 100 °C for reliable performance in harsh environments.
- Compliance RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.
Unique Advantages
- Right-sized logic and memory: Combines roughly 3,100 logic elements with embedded memory to handle control, interfacing, and modest data buffering without over-provisioning.
- High I/O count: 160 I/O pins enable flexible connectivity for sensors, peripherals, and parallel interfaces, reducing external multiplexing or bridge components.
- Industrial temperature tolerance: Rated from −40 °C to 100 °C for deployment in industrial and temperature-challenging applications.
- Compact BGA package: 256-FPBGA (17×17) surface-mount package offers a balance of pin density and board space efficiency for embedded system layouts.
- Regulatory readiness: RoHS compliance supports lead-free manufacturing and environmental standards for modern product assembly.
Why Choose LFEC3E-3F256I?
The LFEC3E-3F256I is positioned for engineers and product teams seeking a mid-range FPGA option that combines a focused set of logic resources, embedded RAM, and a high I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life embedded applications that must operate reliably across wide temperature swings.
Choose this device when your design requires a dependable FPGA with about 3,100 logic elements, approximately 56 kb of on-chip RAM, and 160 I/O pins—all in a surface-mount 256-FPBGA footprint that facilitates dense PCB integration and industrial deployment.
Request a quote or submit an inquiry to obtain pricing, lead-time, and volume availability for the LFEC3E-3F256I. Our team can provide further technical details and support for integrating this FPGA into your design.
