LFEC3E-3FN256C

The LFEC3E-3FN256C is an EC Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation that integrates programmable logic, embedded memory, and a high I/O count in a compact ball-grid array package. It provides 3,100 logic elements and 56,320 bits of on-chip RAM alongside 160 user I/O in a 256-BGA surface-mount footprint.

Designed for commercial-grade applications, the device operates from a core supply range of 1.14 V to 1.26 V and across a 0 °C to 85 °C operating temperature range.

Key Features

• Logic Capacity — 3,100 logic elements to implement combinational and sequential logic functions.
• Embedded Memory — 56,320 bits of on-chip RAM for buffering, state storage, and small tables.
• I/O — 160 general-purpose I/O pins to support multiple peripheral and interface connections.
• Logic Blocks — 384 logic blocks as specified for partitioning and local routing.
• Package and Mounting — 256-BGA, supplied as a 256-FPBGA (17×17) package; surface-mountable for compact board designs.
• Supply Voltage — Core voltage range of 1.14 V to 1.26 V to match low-voltage system rails.
• Operating Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• Right-sized logic and memory — 3,100 logic elements and 56,320 bits of RAM provide moderate-density programmable resources for mid-range designs.
• High I/O density — 160 I/O pins allow flexible interfacing with peripherals, sensors, and external memory.
• Compact, manufacturable package — 256-FPBGA (17×17) surface-mount package supports space-constrained PCBs and automated assembly.
• Low-voltage operation — Narrow 1.14 V to 1.26 V supply window simplifies integration into low-voltage systems.
• Commercial temperature range — Rated for 0 °C to 85 °C to match standard commercial electronics environments.
• RoHS compliant — Conforms to environmental restrictions for lead-free manufacturing processes.

Why Choose LFEC3E-3FN256C?

The LFEC3E-3FN256C positions itself as a compact, commercially graded FPGA option that balances logic capacity, embedded memory, and a substantial I/O count in a 256-BGA package. Its specification set makes it suitable for designers seeking a programmable-logic device with moderate resource requirements and a small board footprint.

With a well-defined core voltage range, commercial operating temperature, and RoHS compliance, the device delivers predictable integration characteristics for volume production and assembly workflows. The combination of logic elements, on-chip RAM, and 160 I/O pins supports a variety of mid-range programmable tasks while keeping BOM and board area considerations in mind.

Request a quote or submit a procurement inquiry today to obtain pricing and availability for LFEC3E-3FN256C.