LFEC33E-5FN672C

The LFEC33E-5FN672C from Lattice Semiconductor Corporation is a commercial-grade EC family FPGA delivering a large logic fabric, significant embedded memory, and high I/O density in a 672-ball BGA package. It combines 32,800 logic elements, approximately 434,176 bits of on-chip RAM, and support for up to 496 I/Os to address mainstream and cost-sensitive embedded designs.

Designed for system-level integration, the device includes on-chip clocking resources and dedicated DSP capabilities from the LatticeECP/EC family to accelerate signal processing and memory-interface functions while minimizing external components.

Key Features

• Logic Capacity — 32,800 logic elements suitable for complex glue logic, state machines, and mid-density FPGA designs.
• Embedded Memory — Approximately 434,176 bits of on-chip RAM for block and distributed memory needs within the design.
• High I/O Count — Up to 496 user I/Os to support wide parallel buses, multi-channel interfaces, and high-pin-count peripherals.
• Dedicated DSP Resources — Family-level sysDSP blocks and high-performance multiply-accumulate capabilities for signal processing tasks (as defined by the LatticeECP/EC family).
• Flexible I/O Standards — Family supports a broad range of interfaces (including multiple LVCMOS levels, LVDS and other differential standards) for interoperability with common logic families and high-speed links.
• Clocking — Up to four on-chip PLLs for clock multiplication, division, and phase adjustments to meet complex timing needs.
• Power — Core supply voltage specified between 1.14 V and 1.26 V to match system power-rail constraints.
• Package & Mounting — 672-ball BGA / 672-FPBGA (27 × 27 mm) surface-mount package for high I/O density in a compact footprint.
• Operating Range & Grade — Commercial grade, rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• Embedded System Control — Implement control logic, protocol bridging, and custom peripherals where a mid-range FPGA fabric and abundant I/O are required.
• Signal Processing and DSP — Use on-chip sysDSP blocks and multiply-accumulate resources for moderate-throughput filtering, transforms, and real-time processing tasks.
• Memory Interface and Buffers — Integrate DDR interfaces and on-chip RAM to manage memory buffering and controller functions for cost-sensitive applications (family supports dedicated DDR interfaces).
• Multi‑I/O Aggregation — Consolidate multiple parallel interfaces or combine numerous low-speed channels into a single programmable hub leveraging the device’s high I/O count.

Unique Advantages

• High logic and memory density: 32,800 logic elements combined with ~434,176 bits of embedded RAM provide the resources needed for mid-complexity designs without external logic.
• Large I/O footprint: 496 I/Os enable integration of multiple peripherals and wide data paths while minimizing board-level wiring complexity.
• On-chip DSP and clocking: Dedicated sysDSP resources and up to four PLLs simplify signal processing and clock-domain management inside the FPGA.
• Compact high-pin package: 672-ball BGA (27 × 27 mm) delivers high connectivity in a manageable PCB area for space-constrained systems.
• Commercial grade and RoHS compliant: Suitable for mainstream commercial designs with standard operating temperature coverage and environmental compliance.
• Vendor ecosystem support: Supported by the LatticeECP/EC family tools and IP ecosystem for streamlined implementation and migration across device densities.

Why Choose LFEC33E-5FN672C?

The LFEC33E-5FN672C positions itself as a capable mid-to-high-density FPGA option for engineers building mainstream embedded systems that require a balance of logic capacity, embedded memory, and high I/O count. Its core voltage range, package density, and on-chip DSP and clocking resources make it suitable for designs that consolidate multiple functions into a single programmable device to reduce BOM and board complexity.

Designed within the LatticeECP/EC family, the device benefits from established toolchain and IP support that help accelerate development, enable density migration, and provide a predictable path for scaling designs across related devices.

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