LFEC33E-4FN672I

The LFEC33E-4FN672I is a Lattice Semiconductor EC-family FPGA offering high fabric density and flexible I/O in a 672-ball BGA package. The device integrates 32,800 logic elements, approximately 0.43 Mbits of on-chip RAM, and up to 496 general-purpose I/O pins to serve mainstream applications requiring programmable logic, memory interfaces and robust I/O support.

Designed for industrial-grade environments, this surface-mount FPGA operates from a 1.14 V to 1.26 V core supply and across an operating temperature range of −40 °C to 100 °C, with RoHS compliance for lead‑free manufacturing.

Key Features

• High Logic Density  Approximately 32,800 logic elements providing substantial fabric capacity for complex glue logic, protocol handling and control functions.
• Programmable Fabric Scale  4,096 programmable function units (PFUs) as part of the device fabric enabling structured placement and routing of large designs.
• Embedded Memory  Approximately 0.43 Mbits (434,176 bits) of total on-chip RAM for distributed and block storage of state, FIFOs and small buffers.
• Extensive I/O  Up to 496 I/O pins accommodate wide parallel buses, multiple interfaces and mixed-signal I/O requirements in a single device.
• Flexible Packaging  672‑BBGA (27 × 27 mm) surface-mount package, supplier device package listed as 672‑FPBGA (27×27), suitable for dense board layouts.
• Low-Voltage Core  Core supply range of 1.14 V to 1.26 V to match modern power-rail architectures and lower core power consumption.
• Industrial Temperature and Mounting  Industrial grade device with an operating range of −40 °C to 100 °C and surface-mount mounting type for PCB assembly.
• Clocking and System Support  Family-level support includes up to four analog PLLs for clock multiplication/division and phase shifting, plus system features such as IEEE 1149.1 boundary scan and SPI boot flash interface.
• Flexible I/O Standards  Family-level I/O buffer support includes a broad set of standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS variants and others) to accommodate varied interface requirements.
• Compliance  RoHS compliant for regulatory and environmental requirements.

Typical Applications

• Industrial Control  Use in sensor aggregation, motor control and PLC interfacing where extended temperature operation and industrial-grade hardware are required.
• Communications and Networking  Protocol bridging, packet handling and parallel interface aggregation leveraging the device’s high I/O count and on-chip RAM for packet buffering.
• Embedded System Glue Logic  Integration of custom control logic, bus interfacing and timing-critical glue that benefits from programmable fabric and PLL clocking.
• Memory Interface and Buffering  Use in designs that require dedicated on-chip RAM for FIFOs, temporary storage and interface staging between subsystems.

Unique Advantages

• Substantial Fabric Capacity:  32,800 logic elements deliver headroom for complex designs without immediate migration to larger families.
• Very High I/O Count:  496 I/Os reduce the need for external multiplexing and enable direct connection to multiple peripherals and buses.
• Integrated Memory:  Approximately 0.43 Mbits of on-chip RAM simplifies buffering and small-data storage, lowering external memory dependency.
• Industrial Robustness:  Rated for −40 °C to 100 °C operation and RoHS compliant, supporting reliable deployment in industrial environments.
• Compact, Board-Friendly Package:  27 × 27 mm 672‑BBGA offers a high pin-count footprint in a compact package for dense PCB designs.
• Power-Aligned Core Voltage:  Narrow core supply range (1.14 V–1.26 V) aligns with modern low-voltage power domains to aid power management strategies.

Why Choose LFEC33E-4FN672I?

The LFEC33E-4FN672I positions itself as a flexible, industrial-grade FPGA solution for designers who need a balance of logic density, extensive I/O and on-chip memory in a compact BGA package. Its combination of 32,800 logic elements, nearly half a Mbit of embedded RAM and 496 I/Os supports integration of control, interface and buffering functions into a single programmable device.

This device suits engineering teams focused on mainstream and industrial embedded systems that require scalable logic resources, flexible interface support and robust temperature performance, backed by Lattice Semiconductor’s ecosystem and tooling for development and deployment.

Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the LFEC33E-4FN672I.