LFEC33E-4FN484C

The LFEC33E-4FN484C is an EC-class Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, built on the LatticeECP/EC family architecture. It provides a mainstream, cost‑focused FPGA fabric with LUT-based logic, embedded memory and flexible I/O suitable for a wide range of mainstream applications.

This device combines substantial on-chip resources — 32,800 logic elements, approximately 0.434 Mbits of total on-chip RAM and 360 I/Os — with system-level features such as multiple PLLs and SPI boot support. The device is supplied in a 484-ball BGA (23 × 23 mm) surface-mount package and is RoHS compliant.

Key Features

• FPGA Architecture  LatticeECP/EC family FPGA fabric with LUT-based logic, distributed and embedded memory and support for mainstream system features.
• Logic Capacity  32,800 logic elements for implementing complex logic and glue functions.
• On‑Chip Memory  Total on-chip RAM: 434,176 bits (approximately 0.434 Mbits) for embedded storage and buffering.
• I/O Density & Flexibility  360 I/Os available in the 484-ball package; family-level programmable I/O buffer support for a broad set of standards including multiple LVCMOS voltages, LVTTL, SSTL, HSTL, PCI, LVDS and related interfaces.
• Clocking and System Support  Up to four analog PLLs per device (family capability), SPI boot flash interface and IEEE 1149.1 boundary-scan support for system integration and debug.
• Power  Voltage supply range: 1.14 V to 1.26 V (nominal 1.2 V operation).
• Package & Mounting  484-BBGA (supplier device package: 484-FPBGA, 23 × 23 mm), surface-mount mounting for compact board integration.
• Temperature & Grade  Commercial grade device with operating temperature range 0 °C to 85 °C.
• Environmental  RoHS compliant.

Typical Applications

• Mainstream embedded systems  Cost-sensitive designs that require programmable logic, moderate on-chip memory and flexible I/O.
• High‑I/O interface designs  Applications that need dense I/O counts and multiple signaling standards supported by the programmable sysI/O buffer.
• Memory interface systems  Designs requiring dedicated DDR memory interfaces (family-level support up to DDR400) and on-chip resources for controller logic.
• System integration and prototyping  FPGA-based prototypes and production designs that benefit from embedded SRAM, multiple PLLs and SPI boot capability.

Unique Advantages

• High integration: 32,800 logic elements and approximately 0.434 Mbits of on-chip RAM reduce the need for external logic and memory components.
• Dense I/O capability: 360 I/Os in a single 484-BBGA package supports complex board-level interfacing without large-package tradeoffs.
• Broad I/O standard support: Family-level programmable I/O buffers support a wide range of signaling standards, simplifying mixed-signal and legacy interface designs.
• System-level features: Multiple PLLs, SPI boot flash interface and boundary-scan support help streamline clocking, boot and test flows.
• Compact BGA packaging: 484-FPBGA (23 × 23 mm) provides a compact footprint for space-constrained designs while maintaining high pin count.
• Design ecosystem support: Family tooling and IP (ispLEVER and ispLeverCORE modules described in the family datasheet) help accelerate implementation and migration within the LatticeECP/EC family.

Why Choose LFEC33E-4FN484C?

The LFEC33E-4FN484C positions itself as a cost-conscious, high‑integration FPGA option for designers needing substantial logic capacity, on-chip RAM and a dense I/O count in a compact BGA package. Its 1.14–1.26 V supply range, commercial operating temperature range and RoHS compliance make it suitable for mainstream electronic and embedded applications.

Engineers targeting board-level designs that require flexible I/O standards, SPI boot and system-level debug support will find this device aligned with mainstream deployment needs. The LatticeECP/EC family ecosystem and available design tools support efficient implementation and migration across densities within the family.

Request a quote for the LFEC33E-4FN484C to receive pricing and availability information for your next design.