LFEC33E-3FN672C

The LFEC33E-3FN672C is an EC family Field Programmable Gate Array from Lattice Semiconductor Corporation designed for mainstream, cost-sensitive FPGA applications. It combines a substantial logic fabric with on-chip memory and extensive I/O to support a wide range of embedded designs that require flexible interfacing and system-level features.

Key Features

• Logic Capacity — 32,800 logic elements provide significant programmable logic resources for complex glue logic, state machines, and moderate-density processing tasks.
• On-chip Memory — Approximately 0.434 Mbits of embedded RAM (434,176 bits) for distributed and block memory requirements within the design.
• I/O Density — 496 user I/Os available in a high-density 672-ball FBGA package, enabling broad external connectivity and multi-interface designs.
• Programmable I/O Standards — Family-level sysI/O buffer support for a wide range of interfaces including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS, enabling flexible system interfacing.
• Clocking — Up to four analog PLLs per device for clock multiply/divide and phase shifting to support complex timing domains.
• DDR Memory Support — Dedicated support for DDR memory interfaces up to DDR400 (200 MHz) to simplify external memory integration.
• Power Supply — Single-core supply range of 1.14 V to 1.26 V to match modern low-voltage system rails.
• Package and Mounting — 672-ball FBGA (27 × 27 mm) surface-mount package (672-BBGA / 672-FPBGA) for compact, high-pin-count board designs.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation to suit standard commercial applications.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Embedded System Controllers — Use the LFEC33E-3FN672C to implement control logic, protocol bridging, and timing-critical interfaces in compact embedded platforms.
• Memory Interface Designs — Leverage the dedicated DDR support and on-chip PLLs for systems requiring external DDR integration and precise clock management.
• High I/O Connectivity — Ideal for designs that require numerous parallel or serialized interfaces thanks to 496 available I/Os and programmable I/O standards.
• Cost-Sensitive Consumer and Industrial Products — Provides mainstream FPGA capabilities in a package suited to cost-aware product designs operating in commercial temperature ranges.

Unique Advantages

• High Logic Density: 32,800 logic elements enable implementation of sizable digital functions without external ASICs or CPLDs.
• Significant On-Chip RAM: Approximately 0.434 Mbits of embedded memory reduces external SRAM requirements for many applications.
• Extensive I/O Count: 496 I/Os in a 672-ball FBGA deliver broad connectivity options for multi-protocol systems and board-level consolidation.
• Flexible Clocking: Up to four analog PLLs support multiple clock domains and phase adjustments required by complex designs.
• DDR Interface Ready: Built-in support for DDR up to DDR400 simplifies integration with external memory devices.
• Compact, High-Pin Package: 27 × 27 mm 672-ball FBGA provides a small footprint for high-pin-count requirements.

Why Choose LFEC33E-3FN672C?

The LFEC33E-3FN672C positions itself as a practical, feature-rich FPGA choice for designers targeting mainstream and cost-sensitive applications. With a large logic element count, meaningful on-chip memory, high I/O density and dedicated support for DDR memory and multiple clock domains, it addresses a broad set of embedded system requirements while maintaining a compact package footprint and commercial temperature rating.

This device is well suited to engineering teams needing scalable logic capacity, flexible interfacing, and system-level features like programmable I/O and PLLs, backed by Lattice’s family-level support and design tools referenced in the product documentation.

Request a quote or submit a purchasing inquiry to evaluate LFEC33E-3FN672C for your next design.