LFEC33E-3F484I

The LFEC33E-3F484I is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It delivers a balance of programmable logic, on-chip memory, and high I/O density in a compact BGA package for embedded and industrial applications.

With 32,800 logic elements, approximately 0.43 Mbits of embedded memory, and 360 I/O pins, this device is suited to designs that require moderate logic capacity, substantial I/O connectivity, and operation across an industrial temperature range.

Key Features

• Core Logic Capacity 32,800 logic elements provide the programmable resources for implementing custom digital functions and moderate-complexity logic designs.
• Embedded Memory Approximately 0.43 Mbits (434,176 bits) of on-chip RAM for buffering, data storage, and logic state requirements.
• I/O Density 360 I/O pins give broad peripheral and signal interfacing capability for sensor aggregation, communication links, and board-level I/O expansion.
• Power Supply Operates from a core voltage range of 1.14 V to 1.26 V, suitable for low-voltage FPGA power domains.
• Package & Mounting 484-ball BGA in a 484-FPBGA (23×23) footprint, designed for surface-mount assembly to save PCB area while supporting high pin-count routing.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, allowing use in industrial and temperature-challenging environments.
• Environmental Compliance RoHS-compliant construction supports regulatory and environmental requirements in modern electronics production.

Typical Applications

• Industrial Automation — Implement motor control logic, I/O aggregation, and protocol bridging while meeting industrial temperature requirements.
• Communications & Networking — Support medium-complexity packet handling, interface adaptation, and signal conditioning with ample I/O connectivity.
• Sensor and I/O Aggregation — Consolidate multiple sensor interfaces and preprocess signals before passing data to a host processor using abundant I/O and on-chip RAM.
• Embedded Control and Prototyping — Provide programmable logic resources for custom control algorithms, state machines, and rapid hardware iterations in development environments.

Unique Advantages

• High I/O Count: 360 I/O pins enable extensive external interfacing without adding external multiplexers or I/O expanders.
• Substantial Logic Resources: 32,800 logic elements deliver the capacity needed for moderate-complexity custom digital designs.
• On-Chip Memory: Approximately 0.43 Mbits of embedded RAM supports buffering and local data storage to reduce external memory dependence.
• Compact BGA Package: 484-ball FPBGA (23×23) footprint balances high pin count with a space-efficient surface-mount solution.
• Industrial Temperature Support: −40 °C to 100 °C rating enables deployment in harsher environments where extended temperature tolerance is required.
• RoHS Compliant: Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose LFEC33E-3F484I?

The LFEC33E-3F484I delivers a combination of programmable logic, embedded memory, and extensive I/O in a compact BGA package targeted at industrial and embedded designs. Its specifications make it suitable for engineers who need a mid-density FPGA with robust I/O and industrial temperature capability.

As an offering from Lattice Semiconductor, this device provides a practical balance of integration and reliability for development and production deployments where RoHS compliance, low-voltage operation, and high I/O count are key decision factors.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the LFEC33E-3F484I.