LFEC33E-3FN484C

IC FPGA 360 I/O 484FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 360 434176 32800 484-BBGA

Quantity 167 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O360Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4096Number of Logic Elements/Cells32800
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits434176

Overview of LFEC33E-3FN484C – EC Field Programmable Gate Array (FPGA) IC 360 434176 32800 484-BBGA

The LFEC33E-3FN484C is an EC-family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a general-purpose FPGA fabric delivering substantial logic capacity, embedded RAM, and a high I/O count in a 484-ball fpBGA (23 × 23 mm) surface-mount package.

Designed for mainstream and cost-sensitive applications, this device combines 32,800 logic elements with flexible I/O, on-chip memory, multiple PLLs and system-level support features to accelerate development and integration in embedded designs.

Key Features

  • Logic fabric — 32,800 logic elements organized across 4,096 logic blocks, providing significant capacity for complex glue logic, control and custom logic functions.
  • Embedded memory — Approximately 0.43 Mbits of on-chip RAM (434,176 bits) for distributed and block memory needs within the design.
  • I/O density & package — 360 available I/Os in a 484-ball fpBGA (484-BBGA / 484-FPBGA, 23 × 23 mm) surface-mount package for high pin-count systems.
  • Programmable I/O standards — sysI/O programmable buffer support for a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS, enabling mixed-interface designs.
  • Clocking — Up to four analog PLLs per device for clock multiply/divide and phase shifting to meet diverse timing requirements.
  • System-level support — IEEE 1149.1 boundary-scan, ispTRACY internal logic analyzer capability and an SPI boot flash interface to support debugging, in-system test and boot configurations.
  • Power and thermal — Core supply range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C, suitable for typical commercial embedded environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Embedded systems and controllers — Use the device’s logic capacity and on-chip RAM to implement control, signal conditioning and custom state machines for mainstream embedded products.
  • Memory interface and buffering — Supports dedicated DDR memory interface functionality and PLL-based clocking to implement memory controllers and data buffering in cost-sensitive designs.
  • High-density I/O and protocol bridging — 360 I/Os and broad sysI/O standard support make the device suitable for protocol conversion, interface bridging and multi-standard front-end tasks.
  • In-system debug and boot — Built-in boundary-scan, ispTRACY logic analysis and SPI boot support streamline development, in-system validation and firmware deployment.

Unique Advantages

  • Substantial logic capacity: 32,800 logic elements and 4,096 logic blocks enable complex designs without immediate up-sizing to larger devices.
  • High I/O count in a compact package: 360 I/Os in a 23 × 23 mm 484-ball fpBGA balance board density and routing flexibility for high-pin-count systems.
  • Flexible interface support: Programmable sysI/O buffers support a wide set of signaling standards to simplify mixed-signal and multi-protocol designs.
  • Built-in system features: Multiple PLLs, boundary-scan and ISP capabilities reduce external component count and simplify system bring-up.
  • Commercial-grade operation and RoHS compliance: 0 °C to 85 °C operating range and RoHS compliance align with mainstream product requirements and environmental regulations.
  • Low-voltage core: 1.14 V to 1.26 V supply range supports modern low-voltage power domains.

Why Choose LFEC33E-3FN484C?

The LFEC33E-3FN484C is positioned for designers who need a high-density, general-purpose FPGA with flexible I/O and integrated system features in a compact surface-mount package. Its combination of 32,800 logic elements, roughly 0.43 Mbits of embedded RAM, 360 I/Os and multiple PLLs makes it well suited to mainstream embedded applications where integration, interface flexibility and development support matter.

With RoHS compliance and commercial-grade operating limits, this device delivers a balanced solution for teams targeting cost-sensitive markets that require scalable logic capacity and broad interface support backed by Lattice’s family-level tool and IP ecosystem.

Request a quote or submit a purchase inquiry to discuss availability and pricing for LFEC33E-3FN484C and how it can fit into your next design.

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