LFEC33E-4F484C

The LFEC33E-4F484C is an EC Field Programmable Gate Array (FPGA) designed for commercial embedded applications. It provides a high logic capacity and substantial on-chip memory in a compact 484-ball BGA package.

With 32,800 logic elements, approximately 0.43 Mbits of embedded RAM, and 360 I/O pins, this device targets designs that require dense programmable logic, significant connectivity, and low-voltage core operation.

Key Features

• Core Logic 32,800 logic elements for implementing complex digital logic and custom functions.
• Embedded Memory Approximately 0.43 Mbits (434,176 bits) of on-chip RAM to support data buffering and state storage.
• I/O Capacity 360 general-purpose I/O pins to accommodate high-density interfacing and multiple peripheral connections.
• Power Core supply range of 1.14 V to 1.26 V to support low-voltage design domains.
• Package & Mounting 484-ball BGA (Supplier device package: 484-FPBGA, 23×23) in a surface-mount configuration for compact PCB layouts.
• Operating Range & Grade Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance RoHS compliant to meet standard environmental requirements for commercial electronics.

Typical Applications

• Commercial Embedded Systems — Use the device's logic capacity and on-chip RAM to implement custom control, signal processing, or glue-logic in commercial equipment.
• High-Density I/O Control — 360 I/Os provide the connectivity needed for systems that require many sensor, actuator, or peripheral interfaces.
• Communication and Data Handling — Leverage the combination of logic elements and embedded memory for protocol handling, data buffering, and custom packet processing in commercial networking equipment.

Unique Advantages

• High Logic Capacity: 32,800 logic elements enable implementation of sizable custom digital designs without immediate upscaling to larger devices.
• Substantial On-Chip RAM: Approximately 0.43 Mbits of embedded memory reduces dependence on external memory for many buffering and state-storage needs.
• Large I/O Count: 360 I/O pins support dense interfacing and simplify board-level routing for multi-sensor or multi-peripheral systems.
• Compact BGA Package: 484-ball FPBGA (23×23) footprint supports high-density PCB designs while maintaining a surface-mount assembly process.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant to align with standard commercial product requirements.
• Low-Voltage Core Support: 1.14 V to 1.26 V supply range fits designs targeting lower core voltages for optimized power domains.

Why Choose LFEC33E-4F484C?

The LFEC33E-4F484C positions itself as a versatile commercial-grade FPGA offering a balance of logic density, embedded memory, and high I/O count in a compact BGA package. Its specification set is suited to designers who need significant on-chip resources and extensive connectivity without moving to larger form-factor devices.

This device is ideal for development and production of commercial embedded systems that require customizable digital logic, moderate on-chip storage, and a high pin count for peripheral integration. Its RoHS compliance and surface-mount BGA package support streamlined manufacturing and regulatory expectations for commercial products.

Request a quote or submit an inquiry to learn about pricing, availability, and lead times for the LFEC33E-4F484C. Provide your project requirements to receive a tailored response.