LFEC33E-3FN484I

IC FPGA 360 I/O 484FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 360 434176 32800 484-BBGA

Quantity 42 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O360Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4096Number of Logic Elements/Cells32800
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits434176

Overview of LFEC33E-3FN484I – EC FPGA, 32.8K logic elements, 360 I/Os, 484-BBGA

The LFEC33E-3FN484I is a Lattice EC family Field Programmable Gate Array (FPGA) in a 484-ball BGA package optimized for mainstream embedded and industrial applications. It provides a high-density programmable fabric with 32,800 logic elements, flexible I/O, and on‑chip memory resources to support control, interface and signal-processing tasks.

Designed for industrial operating conditions, the device supports single-supply core operation in the 1.14 V to 1.26 V range and an operating temperature span of −40 °C to 100 °C, making it suitable for robust board-level systems where density, I/O count and memory integration matter.

Key Features

  • Logic Fabric — 32,800 logic elements provide substantial programmable resources for complex glue logic, protocol adapters and mid-sized processing functions.
  • On-chip Memory — Total of 434,176 bits of on-chip RAM (approximately 0.434 Mbits) for embedded storage, FIFOs and small buffering tasks.
  • I/O Density and Flexibility — 360 available I/Os with a programmable sysI/O buffer that supports a broad range of interfaces including multiple LVCMOS voltage levels, LVTTL, SSTL, HSTL, PCI, LVDS and other differential standards.
  • Clocking and Timing — Analog PLL capability (up to four PLLs available in the family) for clock multiply/divide and phase shifting to support multi-clock designs and memory interfaces.
  • Dedicated Memory Interface — Family-level support for dedicated DDR memory interfaces (up to DDR400) to enable external SDRAM connectivity when larger storage is required.
  • Package and Mounting — 484-ball fpBGA (23 × 23 mm, 484-FPBGA / 484-BBGA) in a surface-mount form factor suitable for compact board layouts.
  • Power and Temperature — Core voltage range 1.14 V to 1.26 V and rated for industrial temperature operation from −40 °C to 100 °C.
  • Standards and Compliance — RoHS compliant and supplied in industry-standard BGA packaging for production assembly.

Typical Applications

  • Industrial Control — Integrate control logic, motor interface glue and sensor aggregation using the device’s logic density and industrial temperature rating.
  • Communications & Networking — Implement protocol bridging, packet parsing or custom PHY interfaces leveraging the high I/O count and flexible I/O standards support.
  • Memory Interface and Buffering — Use built-in RAM and dedicated DDR support for buffering and temporary storage in embedded memory controllers or data-path designs.
  • Embedded Signal Processing — Deploy mid‑range DSP or custom arithmetic pipelines using the FPGA fabric alongside on-chip memory for low-latency data handling.

Unique Advantages

  • High on-board integration: 32,800 logic elements and approximately 0.434 Mbits of on-chip RAM reduce external component count for many mid-sized designs.
  • Extensive I/O capability: 360 I/Os with programmable buffers enable mixed-voltage, single-ended and differential interfaces without additional level-shifters in many cases.
  • Industrial-ready thermal range: Rated −40 °C to 100 °C and supplied in a surface-mount 484-ball BGA to meet rugged deployment needs.
  • Flexible clocking: Up to four PLLs in the family enable multi-domain clocking, frequency synthesis and phase alignment for complex timing requirements.
  • Design ecosystem support: Family-level documentation and development flows (ispLEVER and ispLeverCORE IPs) facilitate implementation and accelerate time-to-prototype.

Why Choose LFEC33E-3FN484I?

The LFEC33E-3FN484I combines a dense programmable fabric, substantial I/O resources and embedded memory in a compact 484-ball BGA package targeted at industrial and embedded applications. Its supply and temperature specifications align with board-level designs that require reliable operation across a wide thermal range while delivering the logic and I/O headroom for data-path and interfacing tasks.

This device suits engineers building mid-sized programmable systems who need measurable on-chip resources, flexible interface support and an established development ecosystem for design portability and long-term scalability.

Request a quote or submit a purchase inquiry to get pricing and availability for the LFEC33E-3FN484I. Our team can provide lead-time information and support for integration into your next design.

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