LFEC33E-3FN672I

The LFEC33E-3FN672I is an industrial-grade EC family FPGA from Lattice Semiconductor, offering a high-density logic fabric and flexible I/O for mainstream and cost-sensitive embedded designs. Built on the LatticeECP/EC architecture, the device combines substantial logic capacity, on-chip memory and broad interface support to address applications that require significant I/O count, system-level integration and reliable operation across extended temperatures.

Key Features

• Logic Capacity — 32,800 logic elements (cells) for implementing complex combinational and sequential logic.
• On-chip Memory — Approximately 0.43 Mbits of total embedded RAM (434,176 bits) to support data buffering, FIFOs and local storage.
• I/O Density — 496 general-purpose I/O pins, enabling high-pin-count interfacing and multi-channel connectivity.
• Package & Mounting — 672-ball BBGA package (27 × 27 mm) in a surface-mount form factor for compact, high-density board designs.
• Power — Core supply specified at 1.14 V to 1.26 V for device operation.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Family-Level Connectivity & Clocking — Family features include flexible programmable I/O standards and up to four analog PLLs for clock management.
• Memory Interface Support — Family-level support for dedicated DDR memory interfaces up to DDR400 (200 MHz) for external memory integration.
• RoHS Compliant — Conforms to RoHS requirements.

Typical Applications

• Embedded Control & Protocol Bridging — Use the device’s logic capacity and extensive I/O to implement protocol translators, interface bridges and control logic in embedded systems.
• High-Density I/O Aggregation — Ideal for applications that require aggregating many signals—such as industrial I/O, sensor arrays or board-level aggregation—leveraging 496 I/Os.
• Memory-Backed Systems — Integrate external DDR memory using the family’s dedicated DDR interface support to handle buffering and data-throughput tasks.
• Cost-Sensitive System Integration — The EC family’s emphasis on mainstream features and low-cost packaging fits designs that require functional integration without unnecessary premium features.

Unique Advantages

• High Logic Density: 32,800 logic elements enable complex designs and feature consolidation onto a single device, reducing board-level BOM.
• Substantial On-Chip RAM: Approximately 0.43 Mbits of embedded memory supports local data storage and buffering without immediate reliance on external RAM.
• Very High I/O Count: 496 I/Os allow flexible interfacing and direct connectivity to many peripherals and external devices.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsher environments where extended temperature range is required.
• Compact, High-Density Package: 672-BBGA (27 × 27 mm) offers a small footprint for high-pin-count solutions, optimizing board space.
• Design Ecosystem Support: The LatticeECP/EC family includes system-level features and toolchain support to accelerate implementation and integration.

Why Choose LFEC33E-3FN672I?

The LFEC33E-3FN672I positions itself as a high-density, industrial-grade EC FPGA suited to mid- to high-complexity embedded designs that demand many I/Os, significant on-chip memory and reliable operation across extended temperatures. Its combination of 32,800 logic elements, roughly 0.43 Mbits of embedded RAM and a 496-pin I/O footprint makes it an effective choice for system architects seeking integration, I/O flexibility and compact packaging.

For teams targeting cost-sensitive mainstream applications that still require scalability and solid vendor tooling, this device offers a balanced set of resources drawn from the LatticeECP/EC family and designed for efficient implementation and long-term deployment.

Request a quote or submit a procurement inquiry to evaluate the LFEC33E-3FN672I for your design requirements and to obtain pricing and availability information.