LFEC33E-4FN672C

The LFEC33E-4FN672C is a commercial-grade EC-family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It provides a high-density logic fabric with 32,800 logic elements and up to 496 I/Os in a 672-ball BGA package for surface-mount board integration.

Designed for mainstream embedded and cost-sensitive applications, this device combines significant on-chip memory and flexible I/O support with a low-voltage core (1.14–1.26 V) and a commercial operating range (0 °C to 85 °C).

Key Features

• Core Capacity  32,800 logic elements (cells) and 4,096 programmable fabric units as indicated for the LFEC33 family.
• On‑chip Memory  Approximately 0.434 Mbits of embedded RAM (434,176 total RAM bits) to support buffering and small data stores on-chip.
• I/O Density & Flexibility  496 available I/Os to implement wide parallel buses and multi‑interface systems; family-level I/O buffer support includes LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
• Clocking  Up to four analog PLLs per device for clock multiplication, division and phase shifting (family capability).
• Memory Interface Support (Family Feature)  Family-level support for dedicated DDR memory interfaces (implements up to DDR400 / 200 MHz) to enable external high-bandwidth RAM connectivity where required.
• Package & Mounting  672‑BBGA package (27 × 27 mm, supplier package 672‑FPBGA) optimized for surface-mount assembly.
• Power & Temperature  Core supply range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• Mainstream Embedded Systems  Use the device’s 32,800 logic elements and 496 I/Os to implement control, protocol handling and custom logic in cost-sensitive embedded products.
• High‑I/O Interfaces  High I/O count supports wide parallel buses, multi‑lane sensor interfaces and board‑level bridging between subsystems.
• On‑chip Buffering and Data Handling  Approximately 0.434 Mbits of embedded RAM is suitable for packet buffers, FIFOs and small data storage to reduce external memory dependency.
• Memory Subsystem Integration  Family-level DDR interface support enables integration with external DDR devices for higher bandwidth system memory when required.

Unique Advantages

• High Logic Density: 32,800 logic elements enable complex designs and feature-rich implementations without immediate migration to larger form factors.
• Large I/O Count: 496 I/Os allow flexible connectivity for multi-sensor, multi-peripheral or parallel-bus applications, reducing the need for external multiplexing logic.
• Embedded Memory Availability: On‑chip RAM (~0.434 Mbits) supports local buffering and reduces external memory bandwidth needs for many designs.
• Compact BGA Package: The 672‑BBGA (27×27 mm) package provides a high pin count in a compact footprint suitable for surface-mount production.
• Design Ecosystem: The LFEC family is supported by Lattice design tools and IP (as documented for the family), which helps accelerate development and integration.

Why Choose LFEC33E-4FN672C?

The LFEC33E-4FN672C positions itself as a high-density, commercially graded FPGA option for developers needing substantial logic capacity, extensive I/O and on-chip memory in a compact BGA package. Its low-voltage core and family-level system features make it suitable for mainstream embedded designs where cost‑effective integration and flexible I/O are priorities.

Engineers building board-level systems that require wide parallel interfaces, local buffering and a strong design-toolchain footprint will find the LFEC33E-4FN672C a practical choice for accelerating development while maintaining predictable supply‑chain and environmental compliance (RoHS).

If you need pricing or availability, request a quote or submit an inquiry to receive a formal quote and lead‑time information for LFEC33E-4FN672C. We can provide ordering details and support for integration into your design.