LFEC33E-5F484C

The LFEC33E-5F484C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a programmable logic platform with 32,800 logic elements, approximately 0.43 Mbits of on-chip RAM, and 360 I/O pins, packaged in a 484-ball BBGA (484-FPBGA, 23×23) intended for surface-mount assembly.

With a low-voltage core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, this device is suited for commercial embedded designs that require mid-range logic capacity, moderate on-chip memory, and a high I/O count in a compact BGA package.

Key Features

• Logic Capacity — 32,800 logic elements to implement custom digital logic, control functions, and glue logic within a single programmable device.
• Embedded Memory — Approximately 0.43 Mbits (434,176 bits) of on-chip RAM to support FIFOs, buffers, and small data stores for deterministic logic operations.
• I/O Density — 360 available I/O pins for broad peripheral connectivity and multi-interface designs.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match compatible system power rails and support low-voltage FPGA implementations.
• Package and Mounting — 484-BBGA package (supplier package: 484-FPBGA, 23×23) with surface-mount mounting for compact board-level integration.
• Operating Range & Grade — Commercial grade with an ambient operating temperature range of 0 °C to 85 °C for typical commercial-environment deployments.
• Compliance — RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, protocol conversion, and system glue logic where a mid-range programmable fabric and high I/O count are required.
• Communication Interfaces — Support for multi-pin interface implementations and parallel/serial logic translation using the device's plentiful I/O resources.
• Prototyping and Development — Hardware prototyping of digital designs that need reprogrammable logic capacity and on-chip RAM for transient data storage.

Unique Advantages

• Balanced Logic and Memory: 32,800 logic elements paired with approximately 0.43 Mbits of RAM provide a balanced resource mix for control-intensive designs.
• High I/O Count: 360 I/Os enable integration of multiple peripherals and interfaces without external I/O expanders, reducing bill-of-materials and board complexity.
• Compact BGA Footprint: The 484-FPBGA (23×23) package delivers high integration density for space-constrained PCBs while supporting surface-mount assembly processes.
• Low-Voltage Core: A narrow core supply range (1.14 V to 1.26 V) helps align the FPGA with low-voltage system architectures and simplifies power-rail planning.
• RoHS Compliance: Lead-free compatibility facilitates conformity with common environmental regulations and manufacturing requirements.

Why Choose LFEC33E-5F484C?

The LFEC33E-5F484C positions itself as a practical choice for commercial embedded designs that need a programmable logic solution with substantial logic element count, moderate embedded memory, and a high number of I/Os in a compact BGA package. Its combination of resources and RoHS compliance makes it suitable for designers seeking to consolidate discrete logic, interface glue, and prototyping capability into a single FPGA device.

This part is appropriate for teams targeting commercial-environment products where deterministic on-chip RAM, flexible I/O allocation, and a compact surface-mount BGA footprint contribute to reduced board complexity and streamlined integration.

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