LFEC3E-3F256C

The LFEC3E-3F256C is a commercial-grade EC family FPGA offering a balanced mix of logic capacity, on-chip memory, and I/O density in a compact 256-ball fpBGA package. It is built on the LatticeECP/EC architecture that provides LUT-based logic, embedded and distributed memory, PLLs and flexible I/O support for mainstream embedded and system applications.

This device targets general-purpose FPGA roles such as embedded control, interface bridging and memory interface implementations where a low-voltage, space-efficient programmable logic solution with moderate RAM and I/O counts is required.

Key Features

• Core Capacity — 3,100 logic elements and 384 logic blocks provide the programmable fabric needed for midsize designs.
• Embedded Memory — Total on-chip RAM of 56,320 bits (approximately 56 Kbits) for distributed and embedded memory usage in buffering, state storage and small SRAM blocks.
• I/O Density — 160 user I/Os enable connection to multiple peripherals, buses and external devices from a single device.
• Package & Mounting — 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package minimizes PCB footprint while delivering high pin-count routing.
• Power — Core supply voltage range 1.14 V to 1.26 V for low-voltage system compatibility.
• Operating Range — Commercial temperature grade rated from 0 °C to 85 °C for standard commercial applications.
• System-Level Features (family) — LatticeECP/EC family support includes PLLs for clock management and dedicated DDR memory interface support up to DDR400 as part of the family feature set.
• Flexible I/O Standards (family) — Family documentation lists support for a broad range of I/O standards to accommodate common interface requirements.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Control — Implement control logic, state machines and peripheral aggregation for consumer and industrial equipment within the commercial temperature range.
• Interface Bridging — Bridge between different digital buses and peripheral interfaces using the device’s flexible I/O and plentiful user I/Os.
• Memory Interface — Implement memory controllers or buffering logic where LatticeECP/EC family DDR support and on-chip RAM can be used for interface staging and timing alignment.
• Prototyping and Integration — Use as a compact programmable fabric for proof-of-concept, mid-volume products and designs requiring a balance between logic, RAM and I/O.

Unique Advantages

• Balanced Logic and Memory — 3,100 logic elements combined with ~56 Kbits of on-chip RAM give designers a practical mix of resources for mid-range FPGA tasks.
• Compact High-Pin Package — 256-ball fpBGA (17 × 17 mm) provides high I/O count in a small footprint, reducing PCB area for space-constrained designs.
• Low-Voltage Core — Core supply range of 1.14 V to 1.26 V aligns with modern low-voltage system power rails.
• Commercial Temperature Rating — Rated 0 °C to 85 °C for mainstream commercial applications and environments.
• Family-Level System Support — Leverages LatticeECP/EC family features such as PLLs and DDR interface capability to simplify system-level design.
• Regulatory Compliance — RoHS compliant to support environmentally conscious product requirements.

Why Choose LFEC3E-3F256C?

The LFEC3E-3F256C positions itself as a mid-density, cost-conscious EC-family FPGA that combines a practical number of logic elements, on-chip RAM and a high I/O count in a compact fpBGA package. Its low-voltage operation and family-level support for memory interfaces and clock management make it suitable for mainstream embedded system designs where board space, I/O and moderate logic capacity matter.

This device is well suited to designers and OEMs seeking a reliable, RoHS-compliant commercial FPGA option that balances integration and system-level capabilities without the overhead of larger devices.

Request a quote or submit an inquiry for pricing and availability of LFEC3E-3F256C to evaluate fit for your next design.