LFEC3E-3FN256I

The LFEC3E-3FN256I is an EC family Field Programmable Gate Array (FPGA) in a 256-ball fpBGA (17 × 17 mm) package, optimized for mainstream, cost-sensitive designs. It provides approximately 3,100 logic elements, roughly 56.3 Kbits of on-chip RAM, and 160 programmable I/Os to implement glue logic, protocol bridging, memory interfaces and embedded control functions.

Built for industrial use, the device supports a 1.14 V–1.26 V core supply and an operating temperature range of −40 °C to 100 °C, with RoHS compliance and surface-mount packaging for space-efficient system integration.

Key Features

• Logic Capacity  Approximately 3,100 logic elements suited for mid-density logic and control functions.
• On-chip Memory  Approximately 56,320 bits of embedded RAM for buffering, FIFO and small data storage requirements.
• I/O  160 programmable I/O pins in the 256‑ball fpBGA package to support multiple parallel and serial interface requirements.
• Power  Low-voltage core operation with a supply range of 1.14 V to 1.26 V to match low‑voltage system rails.
• Package & Mounting  256‑FPBGA (17 × 17 mm) package, surface-mount mounting type for compact board designs.
• Temperature & Grade  Industrial grade device rated for −40 °C to 100 °C operation.
• System Support  Family-level design ecosystem includes ispLEVER design tools and ispLeverCORE IP modules noted in the device family documentation.
• Standards & Compliance  RoHS compliant for environmental and manufacturing compatibility.
• Family Capabilities (series-level)  Lattice ECP/EC family features referenced in the product datasheet include flexible I/O buffering and up to four analog PLLs per device (see family documentation for details).

Typical Applications

• Industrial Control and Automation  Implement motor control logic, sensor aggregation, and supervisory functions that require industrial temperature support and robust I/O count.
• Memory Interface and Buffering  Use for DDR/memory interface glue logic and on-board buffering where embedded RAM and programmable I/O simplify board design.
• Protocol Bridging and I/O Expansion  Aggregate and translate between multiple parallel/serial interfaces using the device’s 160 I/Os and configurable logic elements.
• Embedded System Control  Integrate control, sequencing and peripheral management functions within compact, surface-mount designs.

Unique Advantages

• Right-sized Logic Density:  Approximately 3,100 logic elements provide a balance between capacity and cost for mid-range designs.
• On-chip RAM for Local Storage:  About 56.3 Kbits of embedded RAM reduces external memory needs for many buffering and state storage tasks.
• Broad I/O Count:  160 I/Os in a 256‑ball fpBGA allow flexible interfacing without large packages, simplifying routing and board layout.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C to support deployment in a wide range of environmental conditions.
• Low-voltage Core:  1.14 V–1.26 V core supply supports modern low-voltage system architectures.
• Design Ecosystem:  Series-level tool and IP support (ispLEVER and ispLeverCORE) accelerates design implementation and reduces time-to-market.

Why Choose LFEC3E-3FN256I?

The LFEC3E-3FN256I positions itself as a practical, industrial-grade FPGA option for designers needing mid-range logic capacity, on-chip RAM, and substantial I/O in a compact fpBGA footprint. Its low-voltage operation, RoHS compliance, and family-level design tools make it suitable for cost-sensitive embedded systems, interface bridging, and industrial control applications.

For teams seeking predictable, verifiable FPGA resources with vendor-documented tool support and a clear set of electrical and environmental specifications, this device offers a balanced combination of integration, configurability and deployable temperature range.

Request a quote or submit a pricing inquiry for the LFEC3E-3FN256I to receive availability and ordering information specific to your project requirements.