LFEC3E-3QN208C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 145 56320 3100 208-BFQFP |
|---|---|
| Quantity | 1,491 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 145 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3100 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFEC3E-3QN208C – EC Field Programmable Gate Array (FPGA), 145 I/O, 3,100 logic elements, 208‑BFQFP
The LFEC3E-3QN208C is a commercial-grade EC family FPGA from Lattice Semiconductor, offered in a 208‑BFQFP / 208‑PQFP (28 × 28 mm) surface-mount package. It delivers a balance of logic density, embedded memory and flexible I/O for mainstream commercial and embedded digital designs.
Built on the LatticeECP/EC family architecture, the device targets cost-sensitive, mainstream applications that require a programmable fabric with integrated memory, configurable I/O and system-level features for interface and timing management.
Key Features
- Logic Capacity — 3,100 logic elements (LEs) providing moderate programmable logic resources for glue logic, protocol bridging and control functions.
- Logic Structure — 384 PFUs/PFFs (as indicated in product specifications for this family), supporting efficient placement and routing of logic.
- On‑Chip Memory — Approximately 55 Kbits of embedded RAM (56,320 bits total) for FIFOs, buffering and small data storage inside the FPGA.
- I/O Count and Flexibility — 145 user I/Os in the 208‑pin BFQFP package, compatible with a range of parallel and serial interface options described in the family datasheet.
- Power — Core supply range 1.14 V to 1.26 V, matching the family’s 1.2 V nominal core requirements.
- Clocking and Timing — Up to two analog PLLs (per family data) for clock multiply/divide and phase shifting to support diverse timing requirements.
- Memory Interface Support — Family-level support includes dedicated DDR memory interface logic (up to DDR400), enabling external memory connectivity where required.
- System and Development Support — Family documentation highlights IEEE 1149.1 boundary scan, SPI boot flash interface and ispTRACY internal logic analyzer capability for debug and system bring‑up.
- Package and Mounting — 208‑BFQFP (supplier package noted as 208‑PQFP 28×28) in surface mount format; RoHS compliant.
- Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
Typical Applications
- Embedded Systems — Implement custom control logic, protocol translation and on‑board data handling where moderate logic and embedded RAM are required.
- Interface Bridging — Bridge between disparate digital interfaces using the device’s flexible I/O and family-supported interface standards.
- Memory Interface and Buffering — Use embedded RAM and family DDR interface support for intermediate buffering and memory controllers in cost-sensitive designs.
- Prototyping and Development — Evaluate system architectures or validate custom logic with available design‑tool support and on‑chip debug capabilities.
Unique Advantages
- Balanced Logic and Memory: 3,100 logic elements combined with approximately 55 Kbits of embedded RAM provides a compact platform for integrated control and buffering tasks.
- High I/O Count in a Compact Package: 145 user I/Os in a 208‑pin BFQFP footprint enable rich external connectivity without larger BGA packages.
- Low‑Voltage Core: Narrow core supply range (1.14–1.26 V) aligns with the family’s 1.2 V architecture for predictable power design.
- System-Level Features: Integrated support for boundary scan, SPI boot flash and internal logic analysis simplifies development and system integration.
- Commercial Grade and RoHS Compliant: Designed for commercial temperature ranges (0 °C to 85 °C) and RoHS compliance for regulated supply chains.
- Design Ecosystem: Family documentation references ispLEVER tools and pre‑designed IP modules to accelerate development and migration within the LatticeECP/EC family.
Why Choose LFEC3E-3QN208C?
The LFEC3E-3QN208C is positioned for designers who need a cost-conscious, commercially graded FPGA that combines several hundred I/Os, a moderate logic fabric and embedded RAM in a compact, surface-mount 208‑BFQFP package. Its family-level features—clock PLLs, DDR memory interface support, and system debug capabilities—make it suitable for mainstream embedded applications and interface-centric designs.
For teams focused on rapid development and scalability, the device benefits from the Lattice family ecosystem and migration paths described in the LatticeECP/EC documentation, helping maintain design continuity as requirements evolve.
Request a quote or submit a sales inquiry to check pricing, lead time and availability for the LFEC3E-3QN208C.

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