LFEC20E-5FN672C

IC FPGA 400 I/O 672FPBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 400 434176 19700 672-BBGA

Quantity 679 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O400Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells19700
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits434176

Overview of LFEC20E-5FN672C – EC Field Programmable Gate Array (FPGA) IC 400 434176 19700 672-BBGA

The LFEC20E-5FN672C is a commercial-grade EC family FPGA from Lattice Semiconductor designed for mainstream, cost-sensitive designs that require a balance of logic capacity, on-chip memory and high I/O density. The device implements a LUT-based FPGA fabric with integrated memory and clocking resources, delivered in a 672-ball BGA package suitable for surface-mount assembly.

With 19,700 logic elements, 400 I/Os and approximately 0.43 Mbits of on-chip RAM, the LFEC20E-5FN672C targets system-level applications that need flexible digital logic, plentiful I/O and support for common low-voltage supply rails.

Key Features

  • Logic Capacity  Provides 19,700 logic elements for implementing medium-to-large logic networks and control functions.
  • On-chip Memory  Total on-chip RAM of 434,176 bits (approximately 0.43 Mbits) for embedded storage, buffering and state machines.
  • I/O Density  400 user I/O pins available in the 672-ball package to interface with peripherals, buses and external memory.
  • Package and Mounting  672-ball FPBGA package (27 × 27 mm) supplied in a surface-mount format for high-density board designs.
  • Power Supply  Operates from a core supply range of 1.14 V to 1.26 V, enabling integration into low-voltage power domains.
  • Operating Range  Commercial operating temperature from 0 °C to 85 °C, suitable for standard commercial environments.
  • Family-Level System Support  Platform architecture includes flexible I/O standards, multiple PLLs and embedded/distributed memory options as part of the LatticeECP/EC family architecture.
  • Compliance  RoHS-compliant device to support regulatory and manufacturing requirements.

Typical Applications

  • Memory Interface and Bus Bridging  High I/O count and on-chip RAM support implementation of DDR interfaces, bus adapters and memory controllers within embedded systems.
  • System I/O Aggregation  Large I/O capacity enables aggregation and protocol translation between multiple peripherals and host controllers.
  • Embedded Control and Glue Logic  Provides programmable logic resources for interfacing, control sequencing and custom state machines in commercial electronics.

Unique Advantages

  • Substantial Logic Resources: 19,700 logic elements allow complex logic and control implementations without external ASICs or CPLDs.
  • High I/O Count: 400 I/Os reduce the need for additional interface components and simplify system routing for multi-peripheral designs.
  • Integrated Memory: Approximately 0.43 Mbits of on-chip RAM supports buffering and embedded data storage to streamline system architecture.
  • Compact, Surface-Mount Package: 672-ball FPBGA (27 × 27 mm) provides a compact footprint for high-density PCBs while supporting required I/O levels.
  • Commercial-Grade Thermal Range: Rated for 0 °C to 85 °C operation for standard commercial product deployments.
  • Regulatory Ready: RoHS compliance helps meet environmental and manufacturing requirements.

Why Choose LFEC20E-5FN672C?

The LFEC20E-5FN672C positions itself as a flexible, mid-to-high density FPGA option within the Lattice EC family, combining nearly 20k logic elements, substantial embedded RAM and a 400-pin I/O footprint in a compact 672-ball BGA package. Its low-voltage core range and family-level clocking and I/O capabilities make it suitable for commercial designs requiring configurable logic, memory interfacing and dense I/O integration.

This device is well suited to engineers and procurement teams building scalable, cost-conscious embedded systems who benefit from a vendor-supported FPGA platform and the ability to migrate designs within the same family for different density or feature requirements.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the LFEC20E-5FN672C.

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