LFEC20E-5FN672C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 400 434176 19700 672-BBGA |
|---|---|
| Quantity | 679 Available (as of May 4, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 400 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 19700 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 434176 |
Overview of LFEC20E-5FN672C – EC Field Programmable Gate Array (FPGA) IC 400 434176 19700 672-BBGA
The LFEC20E-5FN672C is a commercial-grade EC family FPGA from Lattice Semiconductor designed for mainstream, cost-sensitive designs that require a balance of logic capacity, on-chip memory and high I/O density. The device implements a LUT-based FPGA fabric with integrated memory and clocking resources, delivered in a 672-ball BGA package suitable for surface-mount assembly.
With 19,700 logic elements, 400 I/Os and approximately 0.43 Mbits of on-chip RAM, the LFEC20E-5FN672C targets system-level applications that need flexible digital logic, plentiful I/O and support for common low-voltage supply rails.
Key Features
- Logic Capacity Provides 19,700 logic elements for implementing medium-to-large logic networks and control functions.
- On-chip Memory Total on-chip RAM of 434,176 bits (approximately 0.43 Mbits) for embedded storage, buffering and state machines.
- I/O Density 400 user I/O pins available in the 672-ball package to interface with peripherals, buses and external memory.
- Package and Mounting 672-ball FPBGA package (27 × 27 mm) supplied in a surface-mount format for high-density board designs.
- Power Supply Operates from a core supply range of 1.14 V to 1.26 V, enabling integration into low-voltage power domains.
- Operating Range Commercial operating temperature from 0 °C to 85 °C, suitable for standard commercial environments.
- Family-Level System Support Platform architecture includes flexible I/O standards, multiple PLLs and embedded/distributed memory options as part of the LatticeECP/EC family architecture.
- Compliance RoHS-compliant device to support regulatory and manufacturing requirements.
Typical Applications
- Memory Interface and Bus Bridging High I/O count and on-chip RAM support implementation of DDR interfaces, bus adapters and memory controllers within embedded systems.
- System I/O Aggregation Large I/O capacity enables aggregation and protocol translation between multiple peripherals and host controllers.
- Embedded Control and Glue Logic Provides programmable logic resources for interfacing, control sequencing and custom state machines in commercial electronics.
Unique Advantages
- Substantial Logic Resources: 19,700 logic elements allow complex logic and control implementations without external ASICs or CPLDs.
- High I/O Count: 400 I/Os reduce the need for additional interface components and simplify system routing for multi-peripheral designs.
- Integrated Memory: Approximately 0.43 Mbits of on-chip RAM supports buffering and embedded data storage to streamline system architecture.
- Compact, Surface-Mount Package: 672-ball FPBGA (27 × 27 mm) provides a compact footprint for high-density PCBs while supporting required I/O levels.
- Commercial-Grade Thermal Range: Rated for 0 °C to 85 °C operation for standard commercial product deployments.
- Regulatory Ready: RoHS compliance helps meet environmental and manufacturing requirements.
Why Choose LFEC20E-5FN672C?
The LFEC20E-5FN672C positions itself as a flexible, mid-to-high density FPGA option within the Lattice EC family, combining nearly 20k logic elements, substantial embedded RAM and a 400-pin I/O footprint in a compact 672-ball BGA package. Its low-voltage core range and family-level clocking and I/O capabilities make it suitable for commercial designs requiring configurable logic, memory interfacing and dense I/O integration.
This device is well suited to engineers and procurement teams building scalable, cost-conscious embedded systems who benefit from a vendor-supported FPGA platform and the ability to migrate designs within the same family for different density or feature requirements.
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