LFEC20E-4FN672C

The LFEC20E-4FN672C is a commercial-grade FPGA from Lattice Semiconductor’s LatticeECP/EC family. It delivers approximately 19,700 logic elements, roughly 0.434 Mbits of on-chip embedded memory, and a high 400-pin I/O count in a 672-ball FBGA (27 × 27 mm) package.

Designed for mainstream commercial applications, this device combines substantial logic capacity and I/O density with low-voltage operation (1.14 V to 1.26 V) and standard commercial operating range (0 °C to 85 °C). It is RoHS-compliant and intended for designers who require a compact, feature-rich FPGA for complex I/O and memory-driven designs.

Key Features

• Core Logic  Approximately 19,700 logic elements suitable for mid-density FPGA implementations and logic-intensive control or data-path functions.
• Embedded Memory  Total on-chip RAM of 434,176 bits (approximately 0.434 Mbits) for block and distributed memory needs within the FPGA fabric.
• I/O Capacity & Package  400 user I/Os in a 672-ball FBGA package (27 × 27 mm), providing high pin count for complex interfacing and board routing.
• Power  Narrow supply voltage range of 1.14 V to 1.26 V, enabling consistent operation in low-voltage system environments.
• Operating Range & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Family-Level Capabilities  As part of the LatticeECP/EC family, the series supports features such as density migration, up to four analog PLLs per device, and dedicated DDR memory interface support at the family level.
• Compliance  RoHS-compliant for material and process conformity in commercial production.

Typical Applications

• Consumer Electronics  Implements user interfaces, peripheral bridging, and custom logic for consumer devices that require compact FPGA solutions with many I/Os.
• Networking & Communications  Provides configurable I/O and embedded memory resources for protocol bridging, packet processing, and interface logic in commercial network equipment.
• Test & Measurement  Useful for custom signal processing, data aggregation, and instrument control where moderate logic density and on-chip memory are required.
• Prototyping & Embedded Systems  Suitable for developers creating prototypes or embedded platforms that need flexible logic, abundant I/O, and on-chip memory for storage and buffering.

Unique Advantages

• High Logic Integration: Approximately 19,700 logic elements enable consolidated implementation of control, glue logic, and data-path functions, reducing external component count.
• Substantial On-Chip Memory: 434,176 bits of embedded RAM provides local buffering and storage to support state machines, FIFOs, and small data caches without external SRAM.
• Large I/O Count in Compact Package: 400 I/Os in a 672-ball FBGA (27 × 27 mm) offers dense pin access for multi-channel interfaces while keeping board area manageable.
• Low-Voltage Operation: Narrow VCC range (1.14 V–1.26 V) aligns with modern low-voltage system rails for power-efficient designs.
• Family-Level Design Flexibility: Benefits from LatticeECP/EC family capabilities such as density migration and multiple PLLs, simplifying upgrades within the product family.
• Design Ecosystem: Series-level support includes the ispLEVER design tool suite and available ispLeverCORE IP modules to accelerate development and integration.

Why Choose LFEC20E-4FN672C?

The LFEC20E-4FN672C is positioned for commercial applications that require a balance of logic capacity, on-chip memory, and a high I/O count in a compact FBGA package. Its specification set is suited for designers building mid-density FPGA solutions that must interface with multiple peripherals and perform localized data buffering or protocol translation.

Choosing this device provides a pathway to scale within the LatticeECP/EC family, leverage family-level features such as PLLs and DDR interface support, and benefit from the available design tools and IP resources to accelerate time to market.

Request a quote or submit an inquiry to check availability and pricing for LFEC20E-4FN672C. Our team can provide further ordering and technical information to support your design evaluation.