LFEC20E-4F484I

IC FPGA 360 I/O 484FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA

Quantity 3 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O360Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells19700
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits434176

Overview of LFEC20E-4F484I – EC Field Programmable Gate Array (FPGA) IC, 484-BBGA

The LFEC20E-4F484I is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for industrial applications. It combines a substantial logic fabric with on-chip memory and a high I/O count in a compact 484-ball BGA package for surface-mount assembly.

With 19,700 logic elements, approximately 0.43 Mbits of embedded memory and 360 I/Os, this device targets designs that require moderate logic capacity, flexible I/O connectivity and operation across an industrial temperature range.

Key Features

  • Logic Capacity — 19,700 logic elements for implementing custom digital logic and control functions.
  • Embedded Memory — Approximately 0.43 Mbits (434,176 bits) of on-chip RAM to support buffering, state storage and small data structures.
  • I/O Count — 360 general-purpose I/Os to enable extensive external device interfacing and multiplexed signal routing.
  • Power — Supported core supply voltage range of 1.14 V to 1.26 V for predictable power budgeting and system design.
  • Package & Mounting — 484-BBGA package (supplier device package 484-FPBGA, 23×23) with surface-mount mounting type for compact board integration.
  • Operating Environment — Industrial operating temperature range of −40 °C to 100 °C to support deployment in harsh or temperature-variable environments.
  • Regulatory Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Industrial Automation — Implement control logic and custom I/O handling using the device’s 19,700 logic elements and 360 I/Os for PLCs, motor drives or factory automation interfaces.
  • Embedded Systems — Use on-chip RAM and abundant I/O to prototype and deploy embedded platforms requiring custom peripherals and glue logic.
  • Communications & Networking — Leverage the high I/O count and programmable logic to manage protocol bridging, packet handling or interface aggregation in networking equipment.
  • Test & Measurement — Build configurable signal conditioning, data capture and processing modules where deterministic logic and numerous I/Os are needed.

Unique Advantages

  • Balanced Logic and Memory: 19,700 logic elements combined with 434,176 bits of RAM provide a practical mix of programmable logic and on-chip storage for mid-range designs.
  • High I/O Density: 360 I/Os enable complex external interfacing without the need for numerous additional I/O expanders.
  • Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployments in temperature-challenging environments.
  • Compact BGA Package: 484-BBGA (484-FPBGA, 23×23) allows a high pin-count implementation in a space-efficient surface-mount form factor.
  • Low-Voltage Core: Narrow core voltage range (1.14 V–1.26 V) supports predictable power design and compatibility with modern low-voltage system rails.
  • RoHS Compliant: Meets common environmental compliance expectations for modern manufacturing.

Why Choose LFEC20E-4F484I?

The LFEC20E-4F484I is positioned for designers who need a mid-capacity FPGA with a high number of I/Os and industrial temperature capability. Its combination of 19,700 logic elements, approximately 0.43 Mbits of embedded RAM, and 360 I/Os in a 484-BBGA package makes it suitable for compact, robust systems requiring flexible programmable logic.

This device provides a practical balance of integration and reliability for industrial and embedded designs that demand predictable power requirements and broad I/O connectivity while maintaining a compact PCB footprint.

Request a quote or submit an inquiry to receive pricing and availability information for LFEC20E-4F484I.

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