LFEC20E-3FN672I

IC FPGA 400 I/O 672FPBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 400 434176 19700 672-BBGA

Quantity 1,242 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O400Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells19700
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits434176

Overview of LFEC20E-3FN672I – EC Field Programmable Gate Array (FPGA) IC 400 434176 19700 672-BBGA

The LFEC20E-3FN672I is a Lattice EC family field programmable gate array designed for mainstream, cost-sensitive applications that require a balanced combination of logic capacity, embedded memory and flexible I/O. Built on the LatticeECP/EC architecture, this device delivers approximately 19,700 logic elements with a fabric and resources suitable for complex glue-logic, protocol bridging and system-level integration tasks.

This device targets industrial-grade applications with support for a wide I/O count and on-chip memory, enabling compact, board-level designs that require programmable logic and dependable operating conditions.

Key Features

  • Logic Capacity  Approximately 19,700 logic elements for implementing mid-size programmable logic designs and combinational/sequential logic functions.
  • On-chip Memory  Approximately 0.43 Mbits (434,176 bits) of embedded memory for buffering, FIFOs and small data structures without external SRAM.
  • I/O Density  400 user I/Os in a 672-ball package, enabling high-pin-count interfaces and multi-channel connectivity on a single device.
  • Package & Mounting  672-BBGA (supplier package: 672-FPBGA, 27 × 27 mm) surface-mount package suited for compact system designs.
  • Power Supply  Core voltage supply range 1.14 V to 1.26 V, consistent with single-rail 1.2 V FPGA operation.
  • Operating Temperature  Industrial operating range from −40 °C to 100 °C for deployment in a wide range of environments.
  • Clocking  Up to four analog PLLs available for clock multiplication, division and phase shifting to support multiple clock domains.
  • DDR Memory Support  Family-level support for dedicated DDR memory interfaces, useful for designs requiring external DRAM connectivity.
  • RoHS Compliant  Manufactured to meet RoHS environmental standards.

Typical Applications

  • Mainstream Embedded Systems  Programmable logic for embedded control, protocol conversion and compact system integration in cost-sensitive designs.
  • High‑I/O Interface Designs  Boards requiring many I/O channels — such as multiport communication interfaces or dense sensor/controllers — benefit from the 400 I/Os.
  • Memory-Connected Systems  Designs that need on-chip memory and dedicated DDR interfaces for buffering and external memory access.
  • Industrial Electronics  Industrial-temperature-rated programmable logic for control and automation systems where −40 °C to 100 °C operation is required.

Unique Advantages

  • Balanced Logic and Memory  Around 19,700 logic elements combined with ~0.43 Mbits of embedded RAM gives designers flexibility to implement both logic-heavy and memory-using functions on the same device.
  • High Pin Count in a Compact BGA  400 I/Os in a 672-ball 27 × 27 mm package enable dense board-level routing while keeping a compact footprint.
  • Industrial Temperature Range  Rated from −40 °C to 100 °C, the device supports designs intended for a wide range of operating environments.
  • Multiple Clock Domains  Up to four PLLs allow refined clock management for multi-frequency systems and timing-critical interfaces.
  • Designed for Cost-Sensitive Applications  Part of the Lattice EC family, optimized to provide mainstream FPGA features at a competitive price point for volume-focused products.
  • Standards-Conscious Manufacturing  RoHS compliance supports regulatory and environmental requirements in modern commercial and industrial products.

Why Choose LFEC20E-3FN672I?

The LFEC20E-3FN672I positions itself as a versatile, industrial-temperature FPGA that balances logic density, embedded memory and high I/O capacity in a compact 672-ball BGA package. It is well suited for engineers building cost-conscious, mid-density programmable solutions that require reliable operation across temperature extremes and robust clocking resources.

Choose this device when you need a dependable, mid-range FPGA platform with ample I/O, on-chip memory and flexible clocking to support system-level functions, protocol handling and external-memory interfaces while keeping board area and BOM complexity under control.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the LFEC20E-3FN672I.

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