LFEC20E-3FN672I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 400 434176 19700 672-BBGA |
|---|---|
| Quantity | 1,242 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 400 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 19700 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 434176 |
Overview of LFEC20E-3FN672I – EC Field Programmable Gate Array (FPGA) IC 400 434176 19700 672-BBGA
The LFEC20E-3FN672I is a Lattice EC family field programmable gate array designed for mainstream, cost-sensitive applications that require a balanced combination of logic capacity, embedded memory and flexible I/O. Built on the LatticeECP/EC architecture, this device delivers approximately 19,700 logic elements with a fabric and resources suitable for complex glue-logic, protocol bridging and system-level integration tasks.
This device targets industrial-grade applications with support for a wide I/O count and on-chip memory, enabling compact, board-level designs that require programmable logic and dependable operating conditions.
Key Features
- Logic Capacity Approximately 19,700 logic elements for implementing mid-size programmable logic designs and combinational/sequential logic functions.
- On-chip Memory Approximately 0.43 Mbits (434,176 bits) of embedded memory for buffering, FIFOs and small data structures without external SRAM.
- I/O Density 400 user I/Os in a 672-ball package, enabling high-pin-count interfaces and multi-channel connectivity on a single device.
- Package & Mounting 672-BBGA (supplier package: 672-FPBGA, 27 × 27 mm) surface-mount package suited for compact system designs.
- Power Supply Core voltage supply range 1.14 V to 1.26 V, consistent with single-rail 1.2 V FPGA operation.
- Operating Temperature Industrial operating range from −40 °C to 100 °C for deployment in a wide range of environments.
- Clocking Up to four analog PLLs available for clock multiplication, division and phase shifting to support multiple clock domains.
- DDR Memory Support Family-level support for dedicated DDR memory interfaces, useful for designs requiring external DRAM connectivity.
- RoHS Compliant Manufactured to meet RoHS environmental standards.
Typical Applications
- Mainstream Embedded Systems Programmable logic for embedded control, protocol conversion and compact system integration in cost-sensitive designs.
- High‑I/O Interface Designs Boards requiring many I/O channels — such as multiport communication interfaces or dense sensor/controllers — benefit from the 400 I/Os.
- Memory-Connected Systems Designs that need on-chip memory and dedicated DDR interfaces for buffering and external memory access.
- Industrial Electronics Industrial-temperature-rated programmable logic for control and automation systems where −40 °C to 100 °C operation is required.
Unique Advantages
- Balanced Logic and Memory Around 19,700 logic elements combined with ~0.43 Mbits of embedded RAM gives designers flexibility to implement both logic-heavy and memory-using functions on the same device.
- High Pin Count in a Compact BGA 400 I/Os in a 672-ball 27 × 27 mm package enable dense board-level routing while keeping a compact footprint.
- Industrial Temperature Range Rated from −40 °C to 100 °C, the device supports designs intended for a wide range of operating environments.
- Multiple Clock Domains Up to four PLLs allow refined clock management for multi-frequency systems and timing-critical interfaces.
- Designed for Cost-Sensitive Applications Part of the Lattice EC family, optimized to provide mainstream FPGA features at a competitive price point for volume-focused products.
- Standards-Conscious Manufacturing RoHS compliance supports regulatory and environmental requirements in modern commercial and industrial products.
Why Choose LFEC20E-3FN672I?
The LFEC20E-3FN672I positions itself as a versatile, industrial-temperature FPGA that balances logic density, embedded memory and high I/O capacity in a compact 672-ball BGA package. It is well suited for engineers building cost-conscious, mid-density programmable solutions that require reliable operation across temperature extremes and robust clocking resources.
Choose this device when you need a dependable, mid-range FPGA platform with ample I/O, on-chip memory and flexible clocking to support system-level functions, protocol handling and external-memory interfaces while keeping board area and BOM complexity under control.
Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the LFEC20E-3FN672I.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016