LFEC20E-3FN484I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 360 434176 19700 484-BBGA |
|---|---|
| Quantity | 432 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 360 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 19700 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 434176 |
Overview of LFEC20E-3FN484I – EC Field Programmable Gate Array (FPGA) IC, 360 I/Os, 19,700 logic elements, 484-BBGA
The LFEC20E-3FN484I is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation, providing a balanced combination of logic capacity, on-chip memory and I/O for industrial designs. It is an industrial-grade, surface-mount FPGA in a 484-BBGA package intended for designs that require substantial I/O, mid-range logic density and reliable operation across an extended temperature range.
Key Features
- Core logic — 19,700 logic elements with 2,464 CLBs, enabling complex digital logic implementations at mid-range density.
- Embedded memory — 434,176 total RAM bits, approximately 0.43 Mbits of on-chip memory for buffering, state storage and local data processing.
- High I/O count — 360 I/Os to support multiple interfaces, parallel buses or extensive sensor and peripheral connectivity.
- Power supply — Operates from a 1.14 V to 1.26 V supply range, suitable for designs using low-voltage core rails.
- Package and mounting — 484-BBGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for compact, high-density PCB layouts.
- Industrial temperature range — Rated for −40 °C to 100 °C operation to meet the demands of industrial environments.
- RoHS compliant — Conforms to RoHS requirements for lead-free assembly and environmental compliance.
Unique Advantages
- High logic integration: 19,700 logic elements and 2,464 CLBs allow implementation of moderately complex digital systems without external logic expansion.
- On-chip memory for efficient data handling: Approximately 0.43 Mbits of embedded RAM supports local buffering and reduces the need for external memory components.
- Extensive connectivity: 360 I/Os provide the flexibility to interface with multiple parallel and serial peripherals or large sensor arrays.
- Industrial reliability: Rated for −40 °C to 100 °C operation, suitable for deployment in temperature-challenging industrial applications.
- Compact, high-density packaging: 484-BBGA (23×23) enables dense board implementations while keeping a small PCB footprint.
- Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and assembly processes.
Why Choose LFEC20E-3FN484I?
The LFEC20E-3FN484I is positioned for industrial applications that require a mid-range FPGA offering a strong mix of logic capacity, embedded memory and high I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs where environmental robustness and regulatory conformity are important.
This device is well suited to development teams and procurement teams seeking an FPGA that balances integration and reliability—providing on-chip resources that help reduce external component count and support scalable, dependable system designs.
Request a quote or submit a purchase inquiry for the LFEC20E-3FN484I to receive pricing and availability information for your next design.
