LFEC20E-3FN672C

The LFEC20E-3FN672C is an EC (EConomy) field-programmable gate array (FPGA) from Lattice Semiconductor, offering a balance of integration, I/O density and on-chip memory for mainstream embedded designs. The device provides 19,700 logic elements, approximately 0.43 Mbits of total on-chip RAM, and up to 400 user I/Os in a 672-ball BGA (27 × 27 mm) package.

Designed for cost-sensitive, high-density applications, this FPGA is suitable for control, interface bridging and system integration roles where a commercial-grade, surface-mount programmable logic solution is required.

Key Features

• Core Logic  19,700 logic elements to implement mid-sized digital functions and control logic.
• Embedded Memory  Approximately 0.43 Mbits of on-chip RAM (434,176 total RAM bits) for frame buffering, FIFOs and small data stores.
• I/O Capacity  Up to 400 user I/Os to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting  672-ball FPBGA (27 × 27 mm) package, surface-mount mounting for compact board-level integration.
• Power  Voltage supply range from 1.14 V to 1.26 V to match system power rails and reduce power-domain complexity.
• Operating Range  Commercial grade operation with specified temperature range from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Interface Bridging  Implement protocol conversion and glue logic between processors, memory and peripherals using the device’s high I/O count and on-chip RAM.
• Embedded Control  Replace discrete logic or microcontroller offloads with programmable logic for motor control, system sequencing and custom control algorithms.
• Data Buffering and Aggregation  Use the embedded RAM as buffers or FIFOs in data-acquisition, sensor aggregation or streaming applications.

Unique Advantages

• High I/O Density: 400 user I/Os enable complex interfaces and parallel connections without external multiplexing.
• Mid-Range Logic Capacity: 19,700 logic elements provide a balance of capacity and cost for mainstream FPGA tasks.
• On-Board RAM: Approximately 0.43 Mbits of embedded memory simplifies designs that need local buffering and storage.
• Compact BGA Package: 672-ball FPBGA (27 × 27 mm) allows high pin count in a compact footprint for space-constrained boards.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C for standard commercial applications and environments.
• RoHS Compliant: Meets common environmental compliance requirements for modern assemblies.

Why Choose LFEC20E-3FN672C?

The LFEC20E-3FN672C positions itself as a practical, cost-aware FPGA choice for designers needing substantial I/O and moderate logic/memory resources in a compact surface-mount package. Its combination of 19,700 logic elements, extensive I/O and embedded RAM makes it well suited to system integration tasks, interface logic and embedded control functions.

Built on the Lattice EC family architecture and supported by Lattice design tools and IP resources, this device offers a straightforward path to implement and migrate mainstream FPGA designs while keeping board-level complexity and BOM count under control.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the LFEC20E-3FN672C.