LFEC20E-3F484I

The LFEC20E-3F484I is an EC Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for industrial applications. It provides a balance of on-chip logic capacity, embedded RAM, and high I/O count for designs that require significant interfacing and local memory.

With 19,700 logic elements, approximately 0.43 Mbits of embedded memory, and 360 I/O, this FPGA targets I/O‑intensive and industrial-grade applications where integration, predictable supply requirements, and extended temperature operation are important.

Key Features

• Core Logic 19,700 logic elements to implement custom digital logic, state machines, and glue logic in a single device.
• Embedded Memory Approximately 0.43 Mbits (434,176 bits) of on-chip RAM for buffers, FIFOs, and local data storage.
• I/O Density 360 general-purpose I/O pins to support extensive sensor, actuator, or bus interfacing without external multiplexing.
• Power Supply Operates from a supply range of 1.14 V to 1.26 V, enabling consistent core power requirements in system designs.
• Package and Mounting 484-BBGA package (supplier device package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board layouts.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for industrial environments and extended-temperature applications.
• Environmental Compliance RoHS compliant to meet common environmental and regulatory requirements for electronic assemblies.

Typical Applications

• Industrial Control and Automation Industrial-grade temperature rating and robust I/O count make this FPGA suitable for control logic, I/O aggregation, and machine interface functions.
• I/O-Intensive Systems High I/O density supports applications that require many external connections such as sensor hubs, protocol bridging, and signal routing.
• Embedded Memory–Dependent Designs On-chip RAM can be used for buffering, small data stores, and temporary packet storage in systems that need local memory without external SRAM/DRAM.

Unique Advantages

• High Logic Capacity: 19,700 logic elements allow substantial digital integration in a single device, reducing the need for additional discrete logic.
• Significant On-Chip Memory: Approximately 0.43 Mbits of embedded RAM supports local buffering and reduces external memory dependence.
• Exceptional I/O Count: 360 I/O pins simplify designs that require many external signals, minimizing connector complexity and board routing challenges.
• Industrial Temperature Range: −40 °C to 100 °C operation provides reliability in harsh or temperature-variable environments.
• Compact, Surface-Mount Package: 484-FPBGA (23 × 23 mm) offers a high-density solution that conserves PCB area while delivering extensive functionality.
• RoHS Compliant: Meets standard environmental requirements for modern electronic manufacturing and product deployment.

Why Choose LFEC20E-3F484I?

The LFEC20E-3F484I positions itself as a versatile, industrial-grade FPGA that combines substantial logic resources, embedded memory, and a very high I/O count in a compact 484‑BBGA package. Its defined supply voltage range and extended operating temperature make it suitable for designs that require predictable power and reliable operation across a wide thermal envelope.

This device is well suited for engineers and system designers building I/O-heavy, industrial, or embedded applications that benefit from on-chip logic integration and local memory. The combination of features supports reduced BOM, simplified board designs, and longer-term deployment in environments where temperature and compliance matter.

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