LFEC20E-4FN672I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 400 434176 19700 672-BBGA |
|---|---|
| Quantity | 720 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 400 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 19700 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 434176 |
Overview of LFEC20E-4FN672I – EC Field Programmable Gate Array (FPGA) IC 400 434176 19700 672-BBGA
The LFEC20E-4FN672I is an EC-family field programmable gate array (FPGA) from Lattice Semiconductor Corporation, provided in a 672-ball BGA package for surface-mount assembly. It delivers a balanced set of resources—approximately 19,700 logic elements, 434,176 total RAM bits and 400 user I/Os—targeted at mainstream FPGA applications that require high I/O density and on-chip memory.
Designed to operate across an industrial temperature range and a nominal 1.2 V supply window, this device supports system-level features and interfaces available across the LatticeECP/EC family to simplify integration into cost-sensitive, performance-oriented designs.
Key Features
- Logic Capacity Approximately 19,700 logic elements to implement medium-complexity digital logic and control functions.
- On‑Chip Memory 434,176 total RAM bits of embedded memory to support buffers, FIFOs and local storage.
- I/O Density 400 user I/O pins available in the 672-ball package for wide interfacing with external devices and peripherals.
- Power Supply voltage range 1.14 V to 1.26 V (nominal 1.2 V) for core power.
- Package & Mounting 672-BBGA (supplier package: 672-FPBGA, 27 × 27 mm) with surface-mount mounting for compact board designs.
- Temperature & Grade Industrial grade operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
- Series-Level System Features LatticeECP/EC family features include flexible programmable I/O buffers supporting multiple standards, dedicated DDR memory interface capability (up to DDR400), up to four analog PLLs, IEEE 1149.1 boundary scan and an SPI boot flash interface (series-level features as documented for the LatticeECP/EC family).
Typical Applications
- Industrial Control Implement motion control, sensor aggregation and deterministic I/O handling using the device’s sizable logic capacity and industrial temperature rating.
- Communications & Networking Use high I/O count and on-chip memory for protocol bridging, packet buffering and interface logic in cost-sensitive network equipment.
- Memory Interface and Buffering Leverage the device’s embedded RAM and series-level DDR interface support for local buffering and memory controller functions.
Unique Advantages
- High I/O count: 400 user I/Os enable broad peripheral and bus connectivity without external multiplexing.
- Generous embedded memory: 434,176 total RAM bits provide on-chip storage for data path buffering and control state.
- Industrial temperature rating: Rated for −40 °C to 100 °C, supporting deployments in demanding thermal environments.
- Compact BGA package: 672-ball FPBGA (27 × 27 mm) offers a high-density footprint for space-constrained boards.
- Series-level system support: Family features such as programmable I/O standards, PLLs, SPI boot and boundary scan help streamline system design and bring-up.
Why Choose LFEC20E-4FN672I?
The LFEC20E-4FN672I provides a practical balance of logic capacity, on-chip memory and I/O density in a compact surface-mount BGA package, making it suitable for mainstream FPGA applications that require reliable operation across industrial temperatures. Its supply voltage range and package options align with common board-level designs, while the LatticeECP/EC family features referenced in the datasheet support practical system integration tasks such as DDR interfacing, clock management and in-system programming.
This device is a fit for engineering teams and procurement looking for a field-programmable solution that combines substantial programmable resources with series-level system capabilities and an industrial operating window.
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