LFEC20E-4FN672I

IC FPGA 400 I/O 672FPBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 400 434176 19700 672-BBGA

Quantity 720 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O400Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells19700
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits434176

Overview of LFEC20E-4FN672I – EC Field Programmable Gate Array (FPGA) IC 400 434176 19700 672-BBGA

The LFEC20E-4FN672I is an EC-family field programmable gate array (FPGA) from Lattice Semiconductor Corporation, provided in a 672-ball BGA package for surface-mount assembly. It delivers a balanced set of resources—approximately 19,700 logic elements, 434,176 total RAM bits and 400 user I/Os—targeted at mainstream FPGA applications that require high I/O density and on-chip memory.

Designed to operate across an industrial temperature range and a nominal 1.2 V supply window, this device supports system-level features and interfaces available across the LatticeECP/EC family to simplify integration into cost-sensitive, performance-oriented designs.

Key Features

  • Logic Capacity  Approximately 19,700 logic elements to implement medium-complexity digital logic and control functions.
  • On‑Chip Memory  434,176 total RAM bits of embedded memory to support buffers, FIFOs and local storage.
  • I/O Density  400 user I/O pins available in the 672-ball package for wide interfacing with external devices and peripherals.
  • Power  Supply voltage range 1.14 V to 1.26 V (nominal 1.2 V) for core power.
  • Package & Mounting  672-BBGA (supplier package: 672-FPBGA, 27 × 27 mm) with surface-mount mounting for compact board designs.
  • Temperature & Grade  Industrial grade operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
  • Series-Level System Features  LatticeECP/EC family features include flexible programmable I/O buffers supporting multiple standards, dedicated DDR memory interface capability (up to DDR400), up to four analog PLLs, IEEE 1149.1 boundary scan and an SPI boot flash interface (series-level features as documented for the LatticeECP/EC family).

Typical Applications

  • Industrial Control  Implement motion control, sensor aggregation and deterministic I/O handling using the device’s sizable logic capacity and industrial temperature rating.
  • Communications & Networking  Use high I/O count and on-chip memory for protocol bridging, packet buffering and interface logic in cost-sensitive network equipment.
  • Memory Interface and Buffering  Leverage the device’s embedded RAM and series-level DDR interface support for local buffering and memory controller functions.

Unique Advantages

  • High I/O count: 400 user I/Os enable broad peripheral and bus connectivity without external multiplexing.
  • Generous embedded memory: 434,176 total RAM bits provide on-chip storage for data path buffering and control state.
  • Industrial temperature rating: Rated for −40 °C to 100 °C, supporting deployments in demanding thermal environments.
  • Compact BGA package: 672-ball FPBGA (27 × 27 mm) offers a high-density footprint for space-constrained boards.
  • Series-level system support: Family features such as programmable I/O standards, PLLs, SPI boot and boundary scan help streamline system design and bring-up.

Why Choose LFEC20E-4FN672I?

The LFEC20E-4FN672I provides a practical balance of logic capacity, on-chip memory and I/O density in a compact surface-mount BGA package, making it suitable for mainstream FPGA applications that require reliable operation across industrial temperatures. Its supply voltage range and package options align with common board-level designs, while the LatticeECP/EC family features referenced in the datasheet support practical system integration tasks such as DDR interfacing, clock management and in-system programming.

This device is a fit for engineering teams and procurement looking for a field-programmable solution that combines substantial programmable resources with series-level system capabilities and an industrial operating window.

Request a quote or submit an inquiry to receive pricing and availability information for LFEC20E-4FN672I.

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