LFEC6E-3F256C

The LFEC6E-3F256C is a commercial-grade EC family FPGA from Lattice Semiconductor Corporation designed for mainstream embedded applications. It delivers a balanced combination of programmable logic, on-chip RAM and flexible I/O in a compact 256-ball fpBGA package.

This device is suited to designs that require approximately 6,100 logic elements, roughly 94 Kbits of on-chip RAM and up to 195 I/O pins, while operating from a nominal 1.2 V supply (1.14 V to 1.26 V) across a commercial temperature range (0 °C to 85 °C).

Key Features

• Programmable Logic  Approximately 6,100 logic elements provide a mid-range fabric for glue logic, control and protocol functions.
• On-chip Memory  Total on-chip RAM of 94,208 bits (approximately 94 Kbits) supports embedded data buffering and small lookup tables.
• I/O Density & Flexibility  195 I/O pins in the 256-ball fpBGA package enable broad interfacing; family-level sysI/O buffer support includes common standards such as LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
• Clocking  Includes analog sysCLOCK PLLs (two PLLs for LFEC6 devices) for clock multiply/divide and phase shifting.
• Power and Supply  Operates with a core supply range of 1.14 V to 1.26 V, matching the LatticeECP/EC family nominal 1.2 V supply.
• Package & Mounting  256-ball fpBGA (17 × 17 mm) package; surface-mount mounting type for space-efficient PCB integration.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation and RoHS compliant for global material requirements.

Typical Applications

• Embedded Systems  Implement glue logic, protocol bridging and control functions where moderate logic density and flexible I/O are required.
• Communications Equipment  Interface and buffer signals for systems that require multiple I/O standards and DDR memory interfaces supported by the family.
• Consumer & Industrial Devices  Support user interfaces, sensor aggregation and mid-complexity control tasks within commercial temperature ranges.
• Prototyping & Low-cost FPGA Designs  Suitable for cost-sensitive FPGA implementations that leverage Lattice’s ispLEVER design tools and available ISP-level IP.

Unique Advantages

• Balanced Logic-to-Memory Ratio: Approximately 6,100 logic elements paired with ~94 Kbits of on-chip RAM provides a practical mix for control and data buffering tasks.
• High I/O Count in a Compact Package: 195 I/Os in a 256-ball fpBGA (17 × 17 mm) give high interface density while conserving PCB area.
• Flexible I/O Standards: Family-level support for a wide range of signaling standards simplifies multi-protocol designs and reduces the need for external translators.
• Clocking Capability: Integrated analog PLLs allow local clock management for timing-critical logic without adding external clock components.
• Commercial-Grade Reliability: 0 °C to 85 °C operating range and RoHS compliance align with general-purpose commercial deployment requirements.
• Ecosystem Support: Compatibility with Lattice development tools and available ispLeverCORE IP accelerates design development and verification.

Why Choose LFEC6E-3F256C?

The LFEC6E-3F256C positions itself as a practical, mid-density FPGA solution for mainstream embedded designs that need a mix of programmable logic, on-chip RAM and extensive I/O in a compact, surface-mount package. Its electrical specifications—1.14 V to 1.26 V core supply and commercial temperature rating—make it suitable for a wide range of commercial applications.

Design teams seeking a cost-effective FPGA with solid ecosystem support, moderate logic capacity and flexible interfacing will find the LFEC6E-3F256C an appropriate choice for accelerating time-to-market and minimizing external component count.

Request a quote or submit a product inquiry for the LFEC6E-3F256C to get pricing and availability information tailored to your project needs.