LFEC6E-3FN256C

The LFEC6E-3FN256C is a Lattice Semiconductor EC-family field programmable gate array (FPGA) supplied in a 256-ball fpBGA (17 × 17 mm) package. It provides approximately 6,100 logic elements and roughly 94,208 bits of on-chip RAM, with 195 user I/Os—positioning it for cost-sensitive, mainstream embedded and interface applications.

Built on the LatticeECP/EC architecture, this device supports general-purpose FPGA features and system-level facilities from the family data sheet, including programmable I/O options and clocking resources, while operating from a 1.14 V to 1.26 V supply range and a commercial temperature rating of 0 °C to 85 °C.

Key Features

• Core Logic: Approximately 6,100 logic elements (6.1K LUTs) for implementing combinational and sequential logic functions.
• On-chip Memory: Approximately 94,208 bits (≈92 Kbits) of embedded RAM to support buffering, small FIFOs and local storage.
• I/O Density and Flexibility: 195 user I/Os provided in the 256-ball fpBGA package to enable dense interface and peripheral connections.
• Package and Mounting: 256-FPBGA (17 × 17 mm) surface-mount package facilitating compact board layouts and high I/O count in a small footprint.
• Power Supply: Nominal operating supply window from 1.14 V to 1.26 V for core power planning and system integration.
• Clocking: Family documentation lists two PLLs for this device class to support clock conditioning, multiplication and phase adjustment.
• Operating Range and Grade: Commercial temperature rating (0 °C to 85 °C) and RoHS-compliant manufacturing status.
• Family Capabilities (per datasheet): The LatticeEC family provides mainstream FPGA elements—LUT-based logic, distributed and block memory, PLLs, and support for a wide range of I/O standards and DDR memory interfaces (as described in the LatticeECP/EC family data sheet).

Typical Applications

• Embedded control and glue logic: Implement custom peripheral interfaces, protocol bridging and control logic where a moderate logic count and dense I/O are required.
• Interface conversion and signal aggregation: Aggregate multiple I/O streams or convert between parallel and serial interfaces using available I/Os and embedded RAM for buffering.
• Memory interface support: Use the device’s family-level DDR support and clocking resources for applications requiring external memory interfaces and timing control.
• Prototyping and low-cost production designs: Commercial-grade FPGA suitable for cost-sensitive, volume-oriented products following mainstream application needs.

Unique Advantages

• Balanced logic and memory capacity: Approximately 6,100 logic elements combined with ~94 Kbits of on-chip RAM provide room for mid-size designs without large external memory needs.
• High I/O count in a compact package: 195 user I/Os in a 256-ball fpBGA (17 × 17 mm) package allow dense connectivity while minimizing board area.
• Commercial-grade operating window: 0 °C to 85 °C rating and RoHS compliance support standard commercial product lifecycles and assembly flows.
• Low-voltage core operation: Narrow core supply range (1.14 V to 1.26 V) simplifies power-supply design for systems targeting efficient core power delivery.
• Family-level system features: Access to LatticeECP/EC family capabilities—such as PLLs, flexible I/O standards, and DDR interface support—helps integrate common system functions without extensive external logic.

Why Choose LFEC6E-3FN256C?

The LFEC6E-3FN256C is positioned as a cost-conscious, general-purpose FPGA that brings a practical mix of logic density, on-chip RAM and I/O capacity in a compact 256-ball fpBGA package. Its characteristics make it suitable for designers who need a mid-range FPGA solution for mainstream embedded applications, protocol bridging, and memory interface tasks while keeping board area and component count low.

Backed by the LatticeECP/EC family documentation and support ecosystem, this device is a practical choice for development teams looking for predictable integration, family-level scalability and documented system features such as PLLs and flexible I/O options.

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