LFEC6E-3FN256I

The LFEC6E-3FN256I is an EC Field Programmable Gate Array (FPGA) in a 256‑BGA surface-mount package designed for industrial applications. It provides 6,100 logic elements, approximately 0.09 Mbits of embedded RAM, and up to 195 general-purpose I/O pins for compact, programmable logic implementations.

Operating from 1.14 V to 1.26 V and rated for −40 °C to 100 °C, this industrial-grade device is suited to embedded and I/O‑intensive designs that require moderate logic density, on‑chip memory, and a high-pin-count package.

Key Features

• Logic Capacity — 6,100 logic elements to implement custom combinational and sequential logic functions.
• Embedded Memory — Total RAM of 94,208 bits (approximately 0.09 Mbits) for small data buffering and state storage.
• I/O Resources — 195 I/O pins to support a broad set of interfaces and parallel connections.
• Package & Mounting — 256‑BGA (256‑FPBGA, 17×17) surface-mount package for space-efficient board layouts.
• Power — Nominal supply range 1.14 V to 1.26 V to match target system rail requirements.
• Temperature & Grade — Industrial grade with an operating range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance — RoHS compliant to meet lead‑free requirements.

Typical Applications

• Industrial Control — Implement custom control logic and interface tasks where industrial temperature range and reliable operation are required.
• Embedded Systems — Provide programmable logic and on‑chip memory for embedded processing, peripheral glue logic, and small-state machines.
• I/O Expansion & Protocol Bridging — Use the high I/O count to consolidate multiple interfaces or perform parallel data handling and bridging functions.

Unique Advantages

• Balanced Logic and Memory: 6,100 logic elements coupled with ~0.09 Mbits of RAM provide a compact balance of combinational/sequential resources and local storage.
• High I/O Count: 195 I/O pins enable extensive external connectivity without additional interface chips, reducing system BOM and board complexity.
• Industrial Qualification: Rated from −40 °C to 100 °C and specified as industrial grade for use in harsher operating environments.
• Space-Saving Package: 256‑BGA (17×17) surface-mount package supports dense board integration in space-constrained designs.
• RoHS Compliant: Meets lead‑free environmental requirements for modern manufacturing processes.

Why Choose LFEC6E-3FN256I?

The LFEC6E-3FN256I delivers a practical combination of logic density, embedded RAM, and a high I/O count in a compact 256‑BGA package, tailored for industrial-grade embedded designs. Its voltage and temperature specifications support reliable integration into systems that must operate across extended environmental ranges.

This device is well suited to engineers and procurement teams building I/O‑heavy modules, interface bridges, or mid-density programmable logic functions where board space, environmental robustness, and regulatory compliance are important.

Request a quote or submit an inquiry for LFEC6E-3FN256I to receive pricing, availability, and lead-time information.