LFEC6E-3F484C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 224 94208 6100 484-BBGA |
|---|---|
| Quantity | 1,850 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 224 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 6100 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LFEC6E-3F484C – EC FPGA IC, 224 I/O, 6100 Logic Elements, 484-BBGA
The LFEC6E-3F484C from Lattice Semiconductor Corporation is an EC Field Programmable Gate Array (FPGA) in a 484‑BBGA (484‑FPBGA, 23×23) surface-mount package. It delivers 6,100 logic elements, approximately 94 kbits of embedded RAM, and 224 user I/O for commercial applications that require reconfigurable logic, substantial I/O density, and on‑chip memory.
Designed for commercial-grade environments, the device operates from a 1.14 V to 1.26 V supply and within an operating temperature range of 0 °C to 85 °C. It is RoHS compliant.
Key Features
- Core / Logic — 6,100 logic elements provide the programmable fabric for custom logic, state machines, and peripheral interfacing.
- Logic Blocks — 768 logic blocks support modular partitioning of designs.
- Embedded Memory — Total on‑chip RAM of 94,208 bits (approximately 94 kbits) for buffering, FIFOs, and small data tables.
- I/O Density — 224 user I/O pins to support parallel interfaces, multi‑signal peripherals, and board-level connectivity.
- Power — Low-voltage operation with a supply range of 1.14 V to 1.26 V to match modern system rails.
- Package & Mounting — 484‑BBGA (supplier package 484‑FPBGA, 23×23) package in a surface-mount profile for compact board placement.
- Temperature & Grade — Commercial grade operation from 0 °C to 85 °C.
- Regulatory — RoHS compliant.
Typical Applications
- Commercial Embedded Systems — Reconfigurable logic and on‑chip RAM support custom control, interface bridging, and protocol handling in commercial electronics.
- Consumer Electronics — High I/O count enables integration of multiple sensors, displays, and peripherals in consumer device designs.
- Prototyping and Development — Moderate logic capacity and dense I/O make this FPGA suitable for early product development and evaluation platforms.
Unique Advantages
- High I/O Capacity: 224 user I/O pins simplify system integration and reduce external interface components.
- Balanced Logic and Memory: 6,100 logic elements combined with ~94 kbits of embedded RAM supports a wide range of mid-sized logic tasks and data buffering.
- Compact BGA Package: 484‑BBGA (23×23) provides a high pin count in a compact, surface‑mount footprint for space‑constrained boards.
- Low-Voltage Operation: 1.14 V to 1.26 V supply compatibility with modern low-voltage systems helps simplify power-rail design.
- Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation to meet common commercial environment requirements.
- RoHS Compliant: Meets environmental regulatory requirements for compliant assemblies.
Why Choose LFEC6E-3F484C?
The LFEC6E-3F484C positions itself as a compact, mid-capacity FPGA for commercial designs that need substantial I/O, meaningful on‑chip memory, and flexible programmable logic. Its combination of 6,100 logic elements, ~94 kbits of RAM, and 224 I/O in a 484‑BBGA package makes it a practical choice for designers balancing integration, board space, and moderate logic requirements.
This device is well suited for engineers and procurement teams building commercial embedded products, consumer devices, and development platforms that require reconfigurable logic from a recognized vendor, along with RoHS compliance and standard commercial temperature operation.
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