LFEC6E-3FN484C

The LFEC6E-3FN484C is a commercial-grade EC-series FPGA that provides a compact, programmable logic fabric with 6.1K LUT-equivalent logic elements, integrated on-chip RAM and a high I/O count. It is designed for mainstream embedded and consumer-facing FPGA applications that require flexible I/O, on-chip memory and low-voltage operation.

Key architectural attributes include approximately 94 Kbits of total on-chip RAM, 224 user I/Os in a 484-ball BGA package, a 1.14 V–1.26 V core supply range and a commercial operating temperature range of 0 °C to 85 °C—making it suitable for volume designs where cost, integration and compact packaging are priorities.

Key Features

• Logic Capacity — 6100 logic elements for implementing combinational and sequential logic in medium-density designs.
• Embedded Memory — Total RAM bits: 94,208, providing approximately 94 Kbits of on-chip memory for buffers, small FIFOs and control-state storage.
• I/O Density and Flexibility — 224 user I/Os in a 484-ball BGA (484-FPBGA, 23 × 23 mm) package, enabling high-pin-count interfacing in a compact footprint.
• Low-Voltage Core — Core supply voltage from 1.14 V to 1.26 V to match modern low-voltage system rails and help optimize power delivery.
• Clocking — PLL resources available for clock management; consult the family selection guide for device-specific PLL counts (LFEC6 devices are listed with 2 PLLs).
• DDR Memory Interface — Family-level support for dedicated DDR memory interfaces up to DDR400 (200 MHz), enabling external memory connectivity for bandwidth-sensitive designs.
• Package & Mounting — 484-ball FBGA in a 23 × 23 mm footprint, surface-mount package ideal for high-density PCB layouts.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• Embedded Systems — Implement control logic, glue logic and interface bridging in compact embedded products using the 6.1K logic elements and abundant I/O.
• Consumer Electronics — Drive user interfaces, peripheral interfaces and local processing functions where a commercial temperature range and small BGA package are appropriate.
• Communications and Connectivity — Use the high I/O count and DDR interface capability for protocol conversion, buffering and intermediate processing in communication modules.
• Prototyping and System Integration — Rapidly prototype medium-density designs that require on-chip RAM and flexible I/O standards supported by the LatticeECP/EC family.

Unique Advantages

• Balanced Logic and Memory — 6100 logic elements combined with approximately 94 Kbits of embedded RAM let you implement control logic and modest data buffering without immediate need for external SRAM.
• High I/O Count in a Compact Package — 224 I/Os in a 23 × 23 mm 484-ball FBGA provides substantial connectivity while minimizing PCB area.
• Low-Voltage Operation — Narrow core supply window (1.14 V–1.26 V) facilitates integration with modern power architectures and efficient power distribution.
• DDR Interface Capability — Family-level dedicated DDR support up to DDR400 enables external memory expansion for designs that require additional bandwidth or storage.
• Commercial-Grade Reliability — Specified for 0 °C to 85 °C operation and RoHS compliance, suitable for mainstream commercial applications.

Why Choose LFEC6E-3FN484C?

The LFEC6E-3FN484C combines a medium-density programmable fabric (6100 logic elements) with substantial I/O capacity and on-chip RAM in a compact 484-ball FBGA package. Its low-voltage core and DDR interface capability make it a practical choice for designers building cost-sensitive, space-constrained systems that need flexible interfacing and embedded memory.

This device is well suited for engineering teams targeting mainstream embedded and consumer applications that require predictable performance, a compact footprint and the support of the LatticeECP/EC family feature set.

Request a quote or contact sales to check availability, pricing and lead time for the LFEC6E-3FN484C.