LFEC6E-4F484I

The LFEC6E-4F484I is an EC Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for industrial-grade embedded applications. It integrates approximately 6,100 logic elements and about 94,208 bits of on-chip RAM in a compact 484-BBGA package for surface-mount assembly.

With 224 user I/Os, a nominal supply range of 1.14 V to 1.26 V, and an operating temperature range of −40°C to 100°C, this device targets designs that require a mid-density programmable logic fabric with industrial temperature capability and compact board-level integration.

Key Features

• Core Logic Approximately 6,100 logic elements to implement custom logic, state machines, and glue logic.
• Embedded Memory Approximately 0.094 Mbits (94,208 bits) of on-chip RAM to support buffering, small lookup tables, and local storage.
• I/O Density 224 programmable general-purpose I/O pins to support multiple interfaces and peripheral connectivity on a single device.
• Package & Mounting 484-BBGA packaged as 484-FPBGA (23×23) for compact, board-level surface-mount integration.
• Power Low-voltage core supply range of 1.14 V to 1.26 V to match modern low-voltage system domains.
• Temperature & Grade Industrial-grade device rated for operation from −40°C to 100°C for deployment in temperature-demanding environments.
• Compliance RoHS compliant for environmentally responsible manufacturing and assembly.

Typical Applications

• Industrial Control Suitable for control and interface functions in industrial equipment where industrial-grade temperature and reliability are required.
• I/O-Dense Embedded Systems 224 I/Os enable aggregation of multiple peripherals and sensors on a single FPGA for compact system designs.
• Compact Board-Level Integration The 484-FPBGA (23×23) package and surface-mount mounting support space-constrained PCB layouts.
• Local Buffering and Logic On-chip RAM and 6,100 logic elements provide resources for buffering, protocol bridging, and auxiliary processing tasks.

Unique Advantages

• Mid-Density Logic Capacity: 6,100 logic elements balance programmability and board-level cost for many embedded tasks.
• High I/O Count: 224 I/Os reduce the need for external multiplexers or additional interface ICs, simplifying BOM and layout.
• Industrial Temperature Rating: −40°C to 100°C operation supports deployment in demanding environments without additional thermal qualification.
• Compact BGA Package: 484-FPBGA (23×23) enables high-density mounting and small PCB footprint for space-constrained systems.
• Low-Voltage Core: 1.14 V to 1.26 V supply compatibility with modern low-voltage system rails.
• RoHS Compliant: Facilitates environmentally compliant manufacturing and global shipment requirements.

Why Choose LFEC6E-4F484I?

The LFEC6E-4F484I provides a balanced combination of programmable logic capacity, embedded memory, and a high I/O count in an industrial-grade, compact BGA package. It is positioned for engineers and procurement teams seeking a mid-density FPGA for embedded systems that require robust temperature performance and a small PCB footprint.

This device suits designs that need flexible I/O aggregation, local buffering, and custom logic implementation while maintaining compatibility with low-voltage system domains. RoHS compliance and surface-mount packaging support streamlined manufacturing and assembly workflows.

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