LFEC6E-4FN256I

The LFEC6E-4FN256I is an industrial-grade FPGA from Lattice Semiconductor’s LatticeECP/EC family. It provides a compact, low-voltage reconfigurable fabric optimized for mainstream embedded applications that require moderate logic capacity, flexible I/O, and on-chip memory resources.

With 6,100 logic elements, approximately 94 Kbits of embedded RAM, and 195 I/Os in a 256-ball fpBGA (17 × 17 mm) package, this device suits designs that need a balance of integration, I/O density, and thermal range for industrial environments.

Key Features

• Logic Capacity — 6,100 logic elements to implement combinational and sequential logic functions for mid-density designs.
• On‑Chip Memory — Approximately 94,208 bits (≈94 Kbits) of total embedded RAM for data buffering, FIFOs, and small on-chip storage needs.
• I/O Density — 195 user I/Os to support multiple peripheral interfaces and parallel I/O requirements in constrained board area.
• Package & Mounting — 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package that enables a small PCB footprint and high pin count.
• Power — Low‑voltage core operation with a specified supply range of 1.14 V to 1.26 V for integration with modern low-voltage power rails.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
• Standards & Compliance — RoHS‑compliant manufacturing to meet environmental and assembly requirements.

Typical Applications

• Industrial Control — Implement custom control logic, motor drive interfaces, and deterministic I/O handling within industrial automation equipment.
• Communications & Networking — Provide protocol bridging, parallel/serial interfacing, and glue-logic for networked systems requiring flexible I/O.
• Embedded Systems — Act as a reconfigurable logic engine for sensor aggregation, preprocessing, and custom peripheral control in embedded platforms.
• Memory & Interface Bridging — Support designs that require moderate on-chip RAM and numerous I/Os to interface with external memory or peripherals.

Unique Advantages

• Balanced Logic and Memory — 6,100 logic elements paired with ~94 Kbits of embedded RAM provide the right balance for mid-density designs without excessive overhead.
• High I/O Count in a Compact Package — 195 I/Os in a 17 × 17 mm fpBGA reduce PCB area while maintaining flexible connectivity options.
• Low-Voltage Operation — 1.14 V to 1.26 V core supply supports integration with modern low-voltage power domains to minimize system power complexity.
• Industrial Temperature Range — Specified −40 °C to 100 °C operation supports deployment in demanding ambient environments.
• Surface-Mount Convenience — 256-ball fpBGA surface-mount package streamlines automated assembly for volume production.
• RoHS Compliance — Meets lead-free and hazardous-materials requirements for regulatory and assembly standards.

Why Choose LFEC6E-4FN256I?

The LFEC6E-4FN256I offers a practical combination of logic density, embedded memory, and high I/O count in a compact fpBGA package, making it appropriate for mid-density embedded and industrial designs. Its low-voltage core and industrial temperature rating provide designers with predictable power integration and environmental robustness.

This FPGA is suited to teams seeking a cost-conscious, reconfigurable solution that supports a variety of mainstream applications where moderate logic capacity, flexible I/O, and reliable industrial operation are key design drivers.

Request a quote or submit a product inquiry to receive pricing, availability, and support for incorporating the LFEC6E-4FN256I into your next design.