LFEC6E-4FN256C

The LFEC6E-4FN256C from Lattice Semiconductor is an EC-family field programmable gate array (FPGA) delivering a balance of logic density, on-chip memory and I/O capacity for mainstream, cost-sensitive designs. The device provides approximately 6,100 logic elements, roughly 94 Kbits of total on-chip RAM, and 195 user I/Os in a 256-ball fpBGA (17 × 17 mm) package.

Designed for general-purpose FPGA roles, the LFEC6E-4FN256C targets embedded control, peripheral interfacing and other applications that require moderate logic resources, flexible I/O and compact packaging while operating from a low-voltage core supply.

Key Features

• Logic Capacity — Approximately 6,100 logic elements to implement medium-complexity control, signal processing and glue-logic functions.
• On-chip Memory — Approximately 94 Kbits (94,208 bits) of total on-chip RAM for distributed and block memory usage within designs.
• I/O Count and Flexibility — 195 user I/Os to support multiple interfaces and peripheral connections in a single FPGA.
• Clocking — Includes 2 PLLs for clock management, frequency multiplication/division and phase control as part of the device family features.
• Power — Core voltage supply range of 1.14 V to 1.26 V, suitable for low-voltage FPGA implementations.
• Package & Mounting — 256-ball fpBGA (256-FPBGA, 17 × 17 mm) in a surface-mount package for compact board layouts.
• Operating Range & Compliance — Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant.
• Design Ecosystem — Supported by the family-level ispLEVER design tool suite and pre-designed ispLeverCORE IP modules for streamlined development (family documentation).

Typical Applications

• Embedded Control — Implement control logic, peripheral management and protocol bridging in compact embedded systems using the device’s logic and I/O resources.
• Consumer and Industrial Interfaces — Manage user interfaces, sensor aggregation and I/O expansion where moderate logic and plentiful I/Os are required within a small package.
• Prototyping and FPGA Integration — Use the LFEC6E-4FN256C for prototyping or integrating FPGA-based functions into cost-sensitive product designs that need a balance of logic, memory and I/O.

Unique Advantages

• Compact, high-density implementation: 6,100 logic elements and 195 I/Os in a 17 × 17 mm 256-ball fpBGA enable feature-rich designs in a small footprint.
• On-chip memory resources: Approximately 94 Kbits of on-chip RAM supports buffering, lookup tables and state storage without external memory for many use cases.
• Low-voltage core operation: Narrow supply range (1.14 V–1.26 V) reduces system power design complexity for the FPGA core.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream product environments.
• Design and IP support: Family-level support with ispLEVER tools and pre-built IP modules helps shorten development time and ease implementation.

Why Choose LFEC6E-4FN256C?

The LFEC6E-4FN256C is positioned for engineers and product teams seeking a balanced FPGA that combines moderate logic density, meaningful on-chip RAM and a high I/O count in a compact fpBGA package. Its commercial temperature rating, RoHS compliance and support within the family design ecosystem make it a practical choice for mainstream embedded designs, interface bridging and feature consolidation where board space and cost are important.

For teams building cost-sensitive systems that require reliable FPGA resources with established development tooling and IP availability, the LFEC6E-4FN256C provides a straightforward, scalable option that aligns with those design priorities.

Request a quote or submit a product inquiry to check availability and obtain pricing for the LFEC6E-4FN256C. Sales and distribution channels can provide delivery lead times and volume pricing information.